SnAgCu/SnBi混装焊点的热循环可靠性研究  

Study on thermal cycling reliability in SnAgCu/SnBi mixed solder joints

作　　者：王凤江[1] 董传淇 WANG Fengjiang;DONG Chuanqi(School of Materials Science and Engineering,Jiangsu University of Science and Technology,Zhenjiang 212100,China)

机构地区：[1]江苏科技大学材料科学与工程学院,镇江212100

出　　处：《江苏科技大学学报（自然科学版）》2024年第2期31-35,共5页Journal of Jiangsu University of Science and Technology:Natural Science Edition

基　　金：国家自然科学基金资助项目(51875269);江苏科技大学本科生创新计划项目。

摘　　要：Sn-Bi和Sn-Ag-Cu混装焊点是利用低熔点的Sn-58Bi锡膏将高熔点的Sn-3.0Ag-0.5Cu(SAC305)的小球回流焊接在印制电路板(PCB)上,从而实现高温芯片的低温焊接工艺.文中研究了SnAgCu/SnBi混装焊点在热循环条件下的可靠性并通过有限元模拟揭示了混装焊点热循环可靠性的应变演变行为.热循环试验发现混装焊点的寿命要优于SAC305无铅焊点.有限元计算表明,结构混装焊点内SnBi钎料层的添加能够减小最大非弹性应变范围,从而提升混装焊点的热循环可靠性.Mixed solder joints are the Sn-Ag-Cu bump with high melting point which is reflowed on PCB by Sn-Bi low temperature paste.This paper mainly studies the thermal cycling reliability of Sn-Ag-Cu/Sn-Bi structural mixed solder joints.Finite element method is employed to investigate the strain distribution in mixed solder joints.The results show that the thermal cycling reliability of the structural composite solder joint is better than that of Sn-Ag-Cu.This is mainly affected by the Sn-Bi solder layer which could narrow the range of non-elastic strain.The non-elastic strain range of structure composite solder joint with 50%Sn-Bi is lower than that of Sn-Ag-Cu solder joint.

关 键 词：混装焊点 无铅钎料 可靠性 热循环 有限元 

分 类 号：TG425[金属学及工艺—焊接]