基于热阻网络的高性能贴装设备温控设计和仿真分析  

Analysis of Thermal Resistance Network on Design and Simulation of High-performance Placement and Bonding Equipment

作　　者：罗夕琼 LUO Xiqiong(Shanghai Integrated Circuit Manufacturing Innovation Center Co.,Ltd.,Shanghai 201210,China;Jiashan Fudan Research Institute,Zhejiang 314102,China)

机构地区：[1]上海集成电路制造创新中心有限公司,上海201210 [2]嘉善复旦研究院,浙江314102

出　　处：《集成电路应用》2024年第4期55-57,共3页Application of IC

摘　　要：阐述利用热阻网络对高性能半导体贴装设备温控系统进行应用分析,通过热阻网络的构建能够快速评估出温控台隔热性能、降温速率等性能,给出有效的设计指导建议。通过仿真验证,显示优化后的温控台散热性能均达到设计指标要求,且与热阻网络分析结果接近。利用热阻网络分析方法可快速收敛设计方案。This paper describes the application of high-performance semiconductor mounting equipment temperature control systems using thermal resistance networks.The construction of thermal resistance networks can quickly evaluate the insulation performance,cooling rate and other performance of temperature control consoles,and provide effective design guidance suggestions.It has been verified through simulation that the optimized heat dissipation performance of the temperature control panel meets the design requirements and is close to the analysis results of the thermal resistance network.The thermal resistance network analysis method can quickly converge the design scheme.

关 键 词：集成电路 热阻网络 贴装设备 温控台 散热性能 

分 类 号：TN405[电子电信—微电子学与固体电子学]