基于SiP技术的信号处理通道设计  

Signal processing channel design based on SiP technology

作　　者：徐波 Xu Bo(Southwest China Institute of Electronic Technology,Chengdu 610036,China)

机构地区：[1]中国西南电子技术研究所,四川成都610036

出　　处：《电子技术应用》2024年第6期27-31,共5页Application of Electronic Technique

摘　　要：随着军用无人机等航电系统不断朝着小型化、智能化、综合化的方向发展,如何有效满足装备的低SWaP(Size,Weight and Power)要求成为一大难题。介绍了某型宽带综合化数字预处理模块的研制,利用“裸芯片+高密度基板”系统级封装(SiP)的方式对信号处理平台(DSP、FPGA、SerDes和DDR芯片)进行集成,替代目前业界普遍采用的“封装芯片+印制板+平面集成”的传统方式,实现宽带综合化数字信号处理模块的高密度集成。在主要性能指标(可编程逻辑资源、定点处理能力、浮点处理能力、数据传输速率)不变的情况下,使得信号处理模块的面积降低为45 mm×45 mm,重量降低到103 g。As military UAVs and other avionics systems continue to develop in the direction of miniaturization,intelligence,and integration,how to effectively meet the low SWaP(Size,Weight and Power)requirements of equipment has become a major problem.In this paper,the development of a certain type of broadband integrated digital preprocessing module is introduced,and the signal processing platform(DSP,FPGA,SerDes and DDR chip)is integrated by using the"bare chip+high-density substrate"system-in-package(SiP)method,which replaces the traditional method of"packaging chip+printed board+planar integration"commonly used in the industry,and realizes the high-density integration of broadband integrated digital signal processing module.Under the condition that the main performance indicators(programmable logic resources,fixed-point processing capabilities,floating point processing capabilities,and data transmission rates)remain unchanged,the area of the signal processing module is reduced to 45 mm×45 mm,and the weight is reduced to 103 g.

关 键 词：系统级封装 软件无线电 信号处理 宽带综合化 机载平台 微小型化设计 

分 类 号：TN47[电子电信—微电子学与固体电子学]