集成电路外部目检方法与典型缺陷案例  

External Visual Inspection Methods and Typical Defect Cases of Integrated Circuits

作　　者：武慧薇 秦杰 吴树洪 WU Huiwei;QIN Jie;WU Shuhong(CEPREI,Guangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子产品可靠性与环境试验》2024年第3期12-17,共6页Electronic Product Reliability and Environmental Testing

摘　　要：集成电路封装是伴随集成电路的发展而前进的。随着宇航、航空、机械、轻工和化工等各个行业的不断发展,整机也向着多功能、小型化方向变化。除高可靠性的气密封装应用外,塑封封装和球栅阵列封装等也在广泛使用。而GJB 548C-2021方法 2009.2主要是检验气密性封装器件的工艺质量,针对塑封封装器件的条款存在缺失,需要结合GJB 4027B-2021工作项目1103对塑封集成电路的质量进行检验。通过对标准进行解读,对塑封集成电路和密封集成电路的外部目检适用的条款进行了分析与总结,对常见的典型缺陷案例进行了展示,并说明了其对可靠性的影响。Integrated circuit packaging has advanced with the development of integrated circuits.With the continuous development of various industries such as aerospace,aviation,machinery,light industry,and chemical industry,the overall machine is also shifting towards multifunctional and miniaturization.In addition to highly reliable airtight packaging applications,plastic packaging and BGA packaging are also used widely.GJB 548C—2021 method 2009.2 is mainly used to inspect the process quality of hermetic packaging devices,there are deficiencies in the terms of plastic encapsulated devices,so it is necessary to combine GJB 4027B—2021 work item 1103 to test the quality of plastic encapsulated integrated circuits.By analyzing the standards,the applicable terms for external visual inspection of plastic encapsulated integrated circuits and hermetic packaging integrated circuits are summarized.Typical defect cases are presented and their influence on reliability is illustrated.

关 键 词：集成电路 外部目检 破坏性物理分析 缺陷 

分 类 号：TN43[电子电信—微电子学与固体电子学]