微波多芯片组件失效模式及质量保证研究  

Research on Failure Modes and Quality Assurance of Microwave Multi-chip Components

作　　者：张敏 李婧 贺卿 文平[1] 王必辉 ZHANG Min;LI Jing;HE Qing;WEN Ping;WANG Bihui(Xi’an Space Radio Technology Research Institute,Xi’an 710100,China)

机构地区：[1]西安空间无线电技术研究所,陕西西安710100

出　　处：《电子产品可靠性与环境试验》2024年第3期18-24,共7页Electronic Product Reliability and Environmental Testing

摘　　要：微波多芯片组件是空间应用必不可少的核心技术装备,其可靠性是目前研究的重点和热点。介绍了微波多芯片组件过电应力损伤、自激振荡引起的组件功能异常、氢效应导致工作电流和增益下降,以及银迁移引起绝缘电阻下降这4种主要的失效模式,对每一种失效模式的机理进行分析并提出针对性质量保证措施,例如:进行电源容限和功率过激励试验分析微波组件实际最大额定工作条件防止过电应力损伤、进行不同工作条件下的稳定性测试提前识别是否存在自激振荡风险、对管壳进行除氢处理并选用耐氢能力高的芯片降低氢效应风险、在设计阶段合理地布线并对生产过程进行控制避免银迁移的发生,旨在提高微波组件的可靠性。Microwave multi-chip component is an essential core technology equipment for space applications,and its reliability is the focus and hotspot of current research.Four main failure modes of microwave multi-chip components,such as overvoltage stress damage,component functional abnormality caused by self-excited oscillation,current and gain reduction caused by hydrogen effects,and insulation resistance reduction caused by silver migration,are introduced.The mechanisms of each failure mode are analyzed,and targeted quality assurance measures are proposed.These measures include conducting power supply capacity and power overexcitation tests to analyze the actual maximum rated operating conditions of microwave components to prevent damage from overvoltage stress,conducting stability tests under different operating conditions to identify the risk of self-excited oscillation in advance,treating the tube shell to remove hydrogen and selecting chips with high hydrogen resistance to reduce the risk of hydrogen effects,and rationally wiring during the design phase and controlling the production process to avoid silver migration.The aim is to improve the reliability of microwave components.

关 键 词：微波 多芯片组件 失效模式 失效机理 可靠性 质量保证措施 

分 类 号：TB114.35[理学—概率论与数理统计]