高厚径比背钻阻焊塞孔溢油问题改善  

Improvement of oil leakage from solder mask plug hole of PCB with high aspect ratio by back drilling

作　　者：潘恒喜 宋国平 PAN Hengxi;SONG Guoping(Delton Technology(Guangzhou)Inc.,Guangzhou 510730,Guangdong,China)

机构地区：[1]广州广合科技股份有限公司,广东广州510730

出　　处：《印制电路信息》2024年第6期22-25,共4页Printed Circuit Information

摘　　要：高厚径比背钻阻焊塞孔溢油问题是阻焊工艺制造方面的难题。影响背钻溢油的要素较多,实际背钻溢油会受到油墨特性、产品设计和过程管控等组成要素的影响。通过对物料选择、资料优化等方面进行探究,介绍了采用高固含量塞孔油墨和资料优化等去预防和降低背钻溢油不良、改善孔内油墨空洞及裂缝问题的方法的方法,为高厚径比背钻阻焊塞孔制作提供一定的参考,可以实现品质改善及效率提高的双重效果。The problem of oil leakage from back drilling solder mask plug hole with high aspect ratio has always been a difficult problem in solder mask manufacturing.There are many factors that affect back drilling oil leakage,and the actual back drilling oil leakage will be affected by ink characteristics,product design and process control.In this paper,materials selection,data optimization and other directions are explored,and high solid content plug hole ink and data optimization are introduced to prevent and reduce the back drilling oil leakage and improve the ink holes and cracks in the hole.This study provides certain reference for the production of high aspect ratio back drilling solder mask plug holes,and achieves the dual effects of improving quality and efficiency.

关 键 词：高厚径比 背钻 阻焊塞孔 溢油 

分 类 号：TN41[电子电信—微电子学与固体电子学]