一种埋置铜块PCB制作工艺研究  

A study on the manufacturing process of embedded copper block PCB

作　　者：孙思雨 杨淳钦 杨淳杰 陈奕皓 武传青 SUN Siyu;YANG Chunqin;YANG Chunjie;CHEN Yihao;WU Chuanqing(Kunshan Suhang Circuit Board Co.,Ltd.,Suzhou 215341,Jiangsu,China)

机构地区：[1]昆山苏杭电路板有限公司,江苏苏州215341

出　　处：《印制电路信息》2024年第6期35-38,共4页Printed Circuit Information

摘　　要：介绍一种在8层印制电路板(PCB)中埋置长形铜块的制作工艺。埋嵌式多层PCB的制造工艺难度较常规多层PCB更高。通常,针对埋嵌铜块位置的制作难点为需要通过开槽方式、铜块制作、压合叠构等工艺流程优化,以实现铜块位置在垂直方向的居中和水平方向的不偏移,使产品板面平整,满足客户对产品各项指标的要求,同时可显著提高埋铜块PCB的良品率。在此阐述的埋置铜块PCB制造工艺,可解决对埋铜块位置有特殊需求产品的生产技术问题。A manufacturing process for embedding long copper blocks in 8-layer printed circuit board(PCB)is introduced.The manufacturing process of embedded multilayer PCBs is more difficult than that of conventional multilayer PCBs,and the production difficulties of embedded copper blocks are usually as follows:after the process optimization of slotting,copper block production,pressing and stacking,the position of the copper block is not shifted in the vertical and horizontal directions,the product surface is flat,the customers'product index requirements are met,and the yield of the embedded copper block PCB can be significantly improved.The manufacturing process of PCB with embedded copper blocks described in this article can solve the production technical problems of products with special requirements for the location of embedded copper blocks.

关 键 词：多层印制板 埋置铜块 开槽 工艺 

分 类 号：TN41[电子电信—微电子学与固体电子学]