新型高导热硅脂封装材料制备及应用性能  

Preparation and application performance of a new type of high thermal conductivity silicone grease packaging material

作　　者：张通 沈斌 ZHANG Tong;SHEN Bin(Hangzhou Yunku Intelligent Technology Co.,Ltd.,Hangzhou 310000,China)

机构地区：[1]杭州云酷智能科技有限公司,浙江杭州310000

出　　处：《粘接》2024年第6期53-56,共4页Adhesion

摘　　要：为加强界面导热材料的散热效果和应用场景适应性,试验制备了一种导热硅脂封装材料,并对其配方进行优化,研究其性能。结果表明,导热硅脂封装材料的优化配方为,以二甲基硅油为基体材料,以球形氧化镁和1%添加量的石墨烯复配作为导热填料,并采用KH-570硅烷偶联剂对导热填料进行表面处理。以优化后的配方制备的导热硅脂封装材料导热系数和黏度分别是2.532 W/(m·K)、37 800 mPa·s,该材料导热性能和流动性良好,且绝缘性能优异,可以适用于浸没式液冷散热场景,起到均匀且有效的散热效果,具备应用价值。To enhance the heat dissipation effect and application scenario adaptability of interface thermal conduc⁃tive materials,a thermal conductive silicone grease packaging material was prepared in this experiment,and its for⁃mula was optimized to study its performance.The results indicated that the optimized formula for thermal conduc⁃tive silicone grease packaging material was:using dimethyl silicone oil as the matrix material,spherical alumina and 1%added graphene as the thermal conductive filler,and using KH-570 silane coupling agent for surface treat⁃ment of the thermal conductive filler.The thermal conductivity and viscosity of the thermal conductive silicone grease packaging material prepared with the optimized formula were 2.532 W/(m·K)and 37800 mPa·s,respec⁃tively.This material had good thermal conductivity and popularity,and excellent insulation performance.It could be suitable for immersive liquid cooling heat dissipation scenarios,providing uniform and effective heat dissipation ef⁃fect,and had application value.

关 键 词：导热硅脂 二甲基硅油 石墨烯 导热系数 黏度 

分 类 号：TQ317[化学工程—高聚物工业]