Toray develops hybrid bonding insulating resin and revolutionary polymer membrane  

出　　处：《China Textile》2024年第3期52-53,共2页中国纺织（英文版）

摘　　要：This year,Toray Industries,Inc.,announced that it has developed an insulating resin material for hybrid bonding(micro bonding).The material is based on Semicofine™and Photoneece™.These are high-heat-resistant polyimide coatings for semiconductor and display devices.The new material combines a conventional polyimide coating agent with the company’s processing and bonding technologies.It can enhance the yields and reliability of semiconductor devices in the hybrid bonding process,which entails bonding semiconductor chips with metal electrodes.Toray will push ahead with prototyping and providing samples to customers.It aims to obtain materials certification in 2025 and start mass production by 2028.

关 键 词：COATING BONDING RESIN 

分 类 号：F416.7[经济管理—产业经济]