多组元Sn基高温软钎料的组织形成规律及性能研究  

Microstructure Formation Law and Properties of Multi-component Sn-based Hightemperature Solder

作　　者：樊江磊 王娇娇 王宁格 吴深 周向葵 李莹 王艳 FAN Jianglei;WANG Jiaojiao;WANG Ningge;WU Shen;ZHOU Xiangkui;LI Ying;WANG Yan(School of Mechanical and Electrical Engineering,Zhengzhou University of Light Industry,Zhengzhou 450002)

机构地区：[1]郑州轻工业大学机电工程学院,郑州450002

出　　处：《特种铸造及有色合金》2024年第6期830-837,共8页Special Casting & Nonferrous Alloys

基　　金：河南省自然基金资助项目(222300420584)。

摘　　要：以Sn元素为基础合金,通过与不同金属元素合金化,熔炼制备了多元Sn基钎料合金,研究了Sn-Cu-Ni-Sb-Bi系钎料合金的组织和性能随混合熵值变化的规律。结果表明,钎料合金的微观组织是由固溶体和析出相Cu3Sn相、Ni3Sn4相和Sn-Sb相组成,随着混合熵值增大,钎料合金组织中的固溶体含量逐渐提高,Sn基体含量逐渐降低,且硬度逐渐增大,硬度(HV0.5)最大为287,硬度(HB)最大为81.8。抗拉强度先增大后减小,且在中熵成分时最大,为65.6 MPa。耐腐蚀性能呈现出逐渐增强的趋势。钎料合金的熔点为141~251℃,电阻率范围为0.101~0.87μΩ·m。综合分析得出,Sn20Cu20Ni20Sb20Bi20钎料合金适合作为高温无铅软钎料使用。Taking Sn as base alloy,a multi-component Sn-based solder alloy was melted and alloyed with different ele⁃ments,and the variation law of microstructure and properties of Sn-Cu-Ni-Sb-Bi alloy with mixing entropy was inves⁃tigated.The results reveal that the microstructure of solder alloy is composed of solid solution and precipitated Cu3Sn,Ni3Sn4 and Sn-Sb phase.With the increase of mixing entropy value,the solid solution content in solder alloy is gradu⁃ally increased,and Sn matrix content is gradually decreased,with the increase of hardness,which reaches the maxi⁃mum of 287 HV0.5 and 81.8 HB.The tensile strength is firstly increased and then decreased,reaching the maximum of 65.6 MPa at medium entropy composition,and the corrosion resistance presents a trend of gradual enhancement.The melting point range of solder alloys is 141~251℃,and the resistivity is ranged from 0.101 to 0.87μΩ·m,indicating that the high-entropy composition of Sn20Cu20Ni20Sb20Bi20 solder alloy is suitable for using as high-temperature lead-free soft solder.

关 键 词：无铅钎料 高熵合金 微观组织 力学性能 

分 类 号：TG425[金属学及工艺—焊接]