超声空化辅助金刚石线锯切割单晶硅机理分析与试验验证  

Mechanism Analysis and Experimental Verification of Ultrasonic Cavitation Assisted Diamond Wire Saw Cutting Monocrystalline Silicon

作　　者：王艳[1] 何顺 陈奕璋 姜晨[1] 钱兆峰 陈浩毅 WANG Yan;HE Shun;CHEN Yizhang;JIANG Chen;QIAN Zhaofeng;CHEN Haoyi(School of Mechanical Engineering,University of Shanghai for Science and Technology,Shanghai 200093)

机构地区：[1]上海理工大学机械工程学院,上海200093

出　　处：《机械工程学报》2024年第9期114-126,共13页Journal of Mechanical Engineering

基　　金：上海市自然科学基金面上资助项目(23ZR1444700)。

摘　　要：金刚石线锯切割单晶硅片作为半导体制造技术中的关键一步,切片质量直接影响着芯片制造的质量和成本。提出了一种超声空化辅助金刚石线锯切割单晶硅片的方法,利用空化气泡溃灭产生的微射流和水锤压力,达到加速切屑的排出,减小锯切力,改善线锯的锯切性能,降低工件表面粗糙度的目的。基于Rayleigh方程,推导了加工区的气泡动力学方程。采用SPH-FEM耦合方法,使用ABAQUS软件建立了近壁面微射流冲击的三维流固耦合模型并进行仿真分析。微射流产生水锤压力峰值的仿真数值与理论数值最大误差为9.67%,验证了理论结果及仿真模型的可靠性。进行了超声空化辅助金刚石线锯切割单晶硅试验。结果表明:超声空化辅助线锯锯切力比传统线锯锯切力降低11.9%~34.5%,超声空化辅助线锯切割加工后的工件表面粗糙度值下降5.03%~37.25%,工件表面的凹坑数量和大小均降低,表面形貌得到很大改善,表明超声空化辅助线锯切割单晶硅可以获得更好的加工质量。Diamond wire saw cutting monocrystalline silicon wafer is a key step in semiconductor manufacturing technology,and its slice quality directly affects the quality and cost of chip manufacturing.An ultrasonic cavitation assisted diamond wire saw method for cutting monocrystalline silicon wafer is proposed,the micro-jet and water hammer pressure generated by cavitation bubble collapse are used to accelerate the chip discharge,reduce the sawing force,improve the sawing performance of the wire saw and reduce the workpiece surface roughness.Based on Rayleigh equation,bubble dynamics equation of processing zone is derived.The SPH-FEM coupling method and ABAQUS software are used to establish a three-dimensional fluid-structure coupling model of near-wall micro-jet impact,and the simulation analysis is carried out.The maximum error between the simulation value and the theoretical value of the peak pressure of the water hammer generated by the micro-jet is 9.67%,which verified the reliability of the theoretical results and the simulation model.The experiment of ultrasonic cavitation assisted diamond wire saw cutting is completed.The results show that the average sawing force of an ultrasonic cavitation-assisted wire saw is 11.9%–34.5%lower than that of a traditional wire saw.The surface roughness of the workpiece decreases by 5.03%to 37.25%,the number and size of pits on the surface of the workpiece are reduced,and the surface topography is greatly improved,indicating that the ultrasonic cavitation-assisted wire saw cutting can obtain better machining quality.

关 键 词：金刚石线锯 超声空化 SPH-FEM耦合方法 水锤压力 

分 类 号：TG48[金属学及工艺—焊接] O786[理学—晶体学]