高厚径比通孔等离子去钻污均匀性提升研究  

Research on the uniformity improvement of plasma desmear for high aspect ratio through hole

作　　者：沙雷 文少东 王蒙蒙 刘志平 王彬 SHA Lei;WEN Shaodong;WANG Mengmeng;LIU Zhiping;WANG Bin(Shennan Circuits Co.,Ltd.,Shenzhen 518100,Guangdong,China)

机构地区：[1]深南电路股份有限公司,广东深圳518100

出　　处：《印制电路信息》2024年第7期31-35,共5页Printed Circuit Information

摘　　要：等离子去钻污已经成为印制电路板(PCB)高速材料除胶渣最受欢迎的方法。针对厚度为8 mm的高速PCB上0.40 mm孔径通孔去钻污均匀性难题,分别研究了反应物活性、气体交换、反应物浓度对提升等离体子去钻污均匀性的影响。研究发现,通过进出气口改造,并采用脉冲进气的方式来提高通孔内外等离子气体交换能力,可以提升通孔去钻污均匀性;提升反应物浓度对等离子去钻污均匀性具有最显著的改善作用,通过调整气流量和气体组分,可以显著抑制孔口去钻污量,并提升孔中的去钻污量,实现0.4 mm通孔去钻污均匀性提升至90%以上。Plasma desmear has become the most popular method for removing smear from high-speed materials of printed circuit boards(PCBs).This article focuses on the problem of uniformity in through holes with a diameter of 0.4 mm on a high-speed PCB with a thickness of 8 mm.The effects of reactant activity,gas exchange,and reactant concentration on improving the uniformity of plasma desmear are studied.Research has found that by modifying the inlet and outlet of the gas and using pulse intake to improve the plasma gas exchange capacity inside and outside the through hole,it is possible to enhance the removal uniformity of the through hole desmear.The concentration of reactants has the most significant improvement effect on the removal uniformity of plasma desmear.By adjusting the gas flow rate and gas composition,the amount of smear at the orifice can be significantly suppressed.The uniformity of 0.4 mm through hole is increased to more than 90%.

关 键 词：高速材料 高厚径比 等离子去钻污 均匀性 

分 类 号：TN41[电子电信—微电子学与固体电子学]