ICP-AES法测定焊锡中金属银的研究分析  

Analysis of Silver in Solder by ICP-AES

作　　者：何龙波 马萍 刘雅如 HE Long-bo;MA Ping;LIU Ya-ru(China Inspection Group Southern Testing Co.,Ltd,Shenzhen,Guangdong,518055,China)

机构地区：[1]中检集团南方测试股份有限公司,广东深圳518055

出　　处：《广州化工》2024年第8期29-30,59,共3页GuangZhou Chemical Industry

摘　　要：本文综述了电感耦合等离子体-原子发射光谱法在测定焊锡中金属银元素的工作原理,文章从待测样品前处理方法、样品制备过程、实验条件、以及数据分析方法四个方面分析了影响电感耦合等离子体-原子发射光谱法检测结果准确度的因素,并提出了相应的提高准确度的改进措施,并在高级算法方面对电感耦合等离子体-原子发射光谱法测定焊锡中金属银的未来发展进行了展望。The principle of Inductively coupled plasma atomic emission spectroscopy in the determination of metallic silver in solders was reviewed,the factors affecting the accuracy of Inductively coupled plasma-atomic emission spectroscopy results were analyzed from four aspects:pretreatment method,sample preparation process,experimental conditions and data analysis method,in addition,the improvement measures to improve the accuracy of the method were proposed,and the future development of Inductively coupled plasma-atomic emission spectroscopy determination of silver in solder was prospected in the aspect of advanced algorithms.

关 键 词：电感耦合等离子体-原子发射光谱法 焊锡 银元素 预测 

分 类 号：TG421[金属学及工艺—焊接]