多芯片封装(MCM)模型库仿真微波产品性能验证技术研究  

Research on the Performance Verification Technology of Multi-chip Package(MCM)Model Library Simulation Microwave Products

作　　者：于长龙 李斌 王国瑾 金亮 YU Changlong;LI Bin;WANG Guojin;JIN Liang(Academy of Space Electronic Information Technology,Xi’an Shanxi 710100,China)

机构地区：[1]空间电子信息技术研究院,陕西西安710100

出　　处：《信息与电脑》2024年第8期34-36,共3页Information & Computer

摘　　要：本文从多芯片封装(Multi-Chip Module,MCM)通道产品的组成和原理架构以及产品特点的角度出发,分析了基于模型库的数字化仿真对于通道产品设计的必要性。结合多芯片封装通道产品指标体系,列举了常用指标和功能的仿真工具和基于仿真模型库的数字化仿真方法。具体介绍了基于仿真模型库的多芯片封装通道产品从局部电路的调用优化到高频结构仿真软件(High Frequency Structure Simulator,HFSS)管壳调用单腔仿真再到先进设计系统(Advanced Design system,ADS)全链路仿真的仿真步骤。最终对数字化仿真和实物测试结果进行对比,说明了基于模型库的MCM通道产品仿真的有效性和实用性。From the perspective of the composition and principle architecture of multi-chip module(MCM)channel products as well as the product features,the necessity of the digital simulation based on the model library for the design of channel products is analyzed.Combined with the index system of multi-chip packaging channel products,the simulation tools for common indicators and functions and the digital simulation method based on the simulation model library are presented.The simulation steps of multi-chip packaging channel products based on the simulation model library from the local circuit call optimization to the HFSS tube shell call single cavity simulation and then to the ADS full-link simulation are specifically introduced.Finally,the digital simulation and the physical test results are compared,which illustrates the validity and practicality of the simulation of MCM channel products based on the model library.

关 键 词：多芯片封装 数字化仿真 仿真模型库 

分 类 号：TN402[电子电信—微电子学与固体电子学]