大数据时代光电共封技术的机遇与挑战  

Opportunities and Challenges of Optoelectronic Co-Packaging Technology in the Era of Big Data

作　　者：卞玲艳 曾燕萍 蔡莹 陆霄 周倩蓉 唐清林 顾廷炜 王辂 Bian Lingyan;Zeng Yanping;Cai Ying;Lu Xiao;Zhou Qianrong;Tang Qinglin;Gu Tingwei;Wang Lu(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214072,Jiangsu,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214072

出　　处：《激光与光电子学进展》2024年第9期65-76,共12页Laser & Optoelectronics Progress

基　　金：中国博士后科学基金面上项目(2022M722962);江苏省自然科学基金(BK20220228)。

摘　　要：人工智能和大数据时代对数据存储、传输和处理能力的需求日益增加,数据传输所需带宽和通信速率也随之增加。然而系统级封装中的电互连受到介质材料、传输速率的影响,表现出强烈的损耗、反射、延迟和串扰等现象,无法满足日益增加的带宽和通信速率的需求。光电共封装技术基于先进封装技术将光模块和电芯片共同封装在同一封装体内,缩短了光模块和电芯片之间的互连长度,减小了寄生效应,具有宽频带、抗电磁干扰、低传输损耗和小功耗等明显优势,成为了近年来的研究热点。本文论述了光电共封装的基本概念、优势特性,梳理了基于2D、2.5D和3D封装的典型技术和国内外最新进展,分析了作为新一代封装技术所面临的挑战。In the era of artificial intelligence and big data,the demand for data storage,transmission,and processing capabilities has surged.Thus,the prerequisites for data transmission,including bandwidth and communication speed,have experienced an escalation.However,owing to the influence of dielectric materials and transmission rate,the electrical interconnections in systemlevel packaging present strong phenomena,such as loss,reflection,delay,and crosstalk,which cannot meet the requirements of increasing bandwidth and communication speed.Consequently,advanced packaging technology and photoelectric copackaging technology encapsulate optical modules and electrical chips within the same package,thereby reducing the interconnection length between them and parasitic effects.Furthermore,it has numerous advantages,such as wide band,antielectromagnetic interference,low transmission loss and power consumption,and hence,it has become a research hotspot in recent years.This article discusses the basic concepts and advantages of optoelectronic copackaging,introduces typical 2D,2.5D,and 3D technologies and the latest developments at home and abroad,and analyzes the challenges that must be addressed as a new generation packaging technology.

关 键 词：光电共封装 2.5D/3D集成 光通信 光电集成 先进封装 

分 类 号：TN29[电子电信—物理电子学]