Chiplet晶圆混合键合技术研究现状与发展趋势  

Research Status and Development Trend of Chiplet Wafer Hybrid Bonding Technology

作　　者：王成君 张彩云 张辉[1] 刘红雨 薛志平 李早阳 乔丽 WANG Chengjun;ZHANG Caiyun;ZHANG Hui;LIU Hongyu;XUE Zhiping;LI Zhaoyang;QIAO Li(School of Mechanical Engineering,Southeast University,Nanjing 211189,China;The 2nd Research Institute of CETC,Taiyuan 030024,China;Xi'an Jiaotong University,Xi'an 710000,China)

机构地区：[1]东南大学机械工程学院,南京211189 [2]中国电子科技集团公司第二研究所,太原030024 [3]西安交通大学,西安710000

出　　处：《电子工艺技术》2024年第4期6-11,共6页Electronics Process Technology

基　　金：国家重点研发计划(2022YFB3404300);科工局基础科研项目(JCKY2019210A002)。

摘　　要：半导体产业对国防安全和国民经济发展意义重大,高端半导体装备也是国外对华技术封锁的重点领域。混合键合技术作为微电子封装和先进制造领域的一种新型连接技术,已经成为实现芯片堆叠、未来3D封装的一项关键技术,是实现高性能、高密度和低功耗芯片设计的关键技术之一。分析了Chiplet晶圆混合键合技术应用背景,梳理了典型工艺及设备研究的现状,并展望了晶圆混合键合技术发展趋势。The semiconductor industry is of great signifi cance to national defense security and national economic development,and high-end semiconductor equipment is also a key field of foreign technology blockade against China.Hybrid bonding technology,as a new connection technology in the field of microelectronics packaging and advanced manufacturing,has become a key technology to realize chip stacking and future 3D packaging,and is one of the key technologies to achieve high performance,high density and low power chip design.The application background of chiplet hybrid bonding technology is analyzed,the research status of typical technology and equipment is reviewed,and the development trend of chiplet hybrid bonding technology is prospected.

关 键 词：晶圆键合 混合键合 异质异构 直接键合 Chiplet 

分 类 号：TN4[电子电信—微电子学与固体电子学]