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作 者:邓超 王天石[1] 张怡[1] 刘镜波[1] DENG Chao;WANG Tianshi;ZHANG Yi;LIU Jingbo(The 29th Research Institute of CETC,Chengdu 610036,China)
机构地区:[1]中国电子科技集团公司第二十九研究所,成都610036
出 处:《电子工艺技术》2024年第4期12-14,共3页Electronics Process Technology
基 金:国家科技部重点研发计划(2023YFB4603904)。
摘 要:针对曲面电路中无法采用片式贴片电阻回流焊接的难题,创新地采用喷墨打印技术打印曲面薄层电阻,开展了高温环境对薄层电阻阻值变化的影响研究。经测试,喷墨打印曲面电路中薄层电阻在经过高温可靠性测试后,薄层电阻结合力和阻值变化均能达到设计要求,电阻阻值精度为±20%。论证了曲面电路中喷墨打印薄层电阻的可靠性,可有效用于射频曲面电路的快速制造和快速验证,并缩短了研发周期。In response to the diffi culty of using chip resistor refl ow soldering in curved circuits,innovative inkjet printing technology is used to print curved thin layer resistors,and a study is conducted on the infl uence of high temperature environment on the variation of thin layer resistance values.After testing,it is found that the thin layer resistance in inkjet printed curved circuit can meet the design requirements in terms of adhesion and resistance value changes after high-temperature reliability testing,with a resistance accuracy of±20%.The reliability of inkjet printed thin layer resistors in curved circuits has been demonstrated,which can be effectively used for rapid manufacturing and verification of RF curved circuits,and shorten the research and development cycle.
分 类 号:TN605[电子电信—电路与系统]
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