大尺寸厚层硅外延片表面滑移线缺陷检验研究  

Study on Defect Inspection of Surface Slip Line on Large-Size Thick-Layer Silicon Epitaxial Wafers

作　　者：葛华 王银海 杨帆 尤晓杰 GE Hua;WANG Yinhai;YANG Fan;YOU Xiaojie(Nanjing Guosheng Electronics Co.,Ltd.,Nanjing 211100,China)

机构地区：[1]南京国盛电子有限公司,南京211100

出　　处：《电子与封装》2024年第7期85-89,共5页Electronics & Packaging

摘　　要：目前制约大尺寸厚层硅外延产品高质量生产的主要因素是表面滑移线,而滑移线的过程控制严重依赖于滑移线的完整、准确检验识别。通过对不同宏观显现的滑移线表征方法的研究,比较了各类检验的误差来源,分析出了影响硅外延滑移线量化计算的主要因素,制定了科学合理的检验策略,提高了批量生产过程中滑移线检验的准确性与稳定性,取得了显著成效。At present,the main factor restricting the high-quality production of large-size thick-layer silicon epitaxial products is the surface slip line,and the process control of the slip line heavily relies on the complete and accurate inspection and identification of the slip line.By studying the characterization methods of slip lines with different macro-expression,the error sources of various inspections are compared,the main factors affecting the quantitative calculation of silicon epitaxial slip lines are analyzed,and a scientific and reasonable inspection strategy is formulated to improve the accuracy and stability of slip line inspection in the process of mass production,which has achieved remarkable results.

关 键 词：滑移线 检验误差 量化计算 

分 类 号：TN307[电子电信—物理电子学]