Cu-Ti复合焊料钎焊Si_(3)N_(4)陶瓷/Cu的显微结构和力学性能研究  

Microstructure and Mechanical Properties of Cu-Ti Composite Soldering Brazed Si_(3)N_(4)/Cu Joint

作　　者：杜仲杰 李丹[1] 张雨欣 肖勇[1] DU Zhongjie;LI Dan;ZHANG Yuxin;XIAO Yong(School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,Hubei,China)

机构地区：[1]武汉理工大学材料科学与工程学院,湖北武汉430070

出　　处：《陶瓷学报》2024年第3期566-574,共9页Journal of Ceramics

摘　　要：本研究采用Cu-Ti复合焊料在不同温度和保温时间钎焊了Si_(3)N_(4)/Cu接头,研究了不同钎焊参数对接头显微组织和力学性能的影响。实验结果表明,接头的相组成主要是TiN、Ti_(5)Si_(3)和Cu-Ti化合物。在较低温度(890℃)下,Ti_(5)Si_(3)率先生长,较少的Ti扩散到了Cu里生成Cu_(3)Ti;当延长保温时间或提升钎焊温度(920℃)时,TiN在界面处沉积成薄层,Cu_(3)Ti也转变成了CuTi,同时,Ti_(5)Si_(3)在Cu里也有一定的扩散;当钎焊温度过高(950℃)时,Ti和Si_(3)N_(4)的反应程度较大,Cu-Ti化合物作为反应的中间相被消耗,剥离强度随着温度的升高呈现先升高后下降的趋势。在920℃钎焊60 min的接头中,TiN逐渐剥离出薄层,进一步优化界面组织,接头剥离强度最高,达到16.69 N·mm^(-1)。Cu-Ti composite solder was used to braze Si_(3)N_(4)/Cu joints at different temperatures for different holding time durations,focusing on the effects of brazing parameters on their microstructure and mechanical properties.It is found that the main phases include TiN,Ti_(5)Si_(3)and Cu-Ti.At low temperatures(890℃),Ti_(5)Si_(3)was formed first.Due to the low reaction extent,less Ti diffused into Cu,resulting in the formation of Cu_(3)Ti.With prolonged holding time or elevation to higher temperatures(920℃),TiN was formed as a thin layer at the interfaces.More Ti diffused into Cu,leading to the transformation of Cu_(3)Ti into CuTi.Simultaneously,Ti_(5)Si_(3)also diffused into Cu to a certain degree.At excessively high brazing temperatures(950℃),there was a significant reaction between Ti and Si_(3)N_(4),leading to the consumption of Cu-Ti compounds as intermediate phases.Consequently,the peel strength showed an initial increase,followed by a decrease with increasing temperature.In the joint brazed at 920℃for 60 min,TiN gradually peeled off in thin layers,further optimizing the interface structure.The peel strength of the joint reached highest value of 16.69 N·mm^(-1).

关 键 词：活性金属钎焊 氮化硅 铜钛焊料 陶瓷覆铜板 AMB 

分 类 号：TQ174.75[化学工程—陶瓷工业]