多芯片高精度固晶设备控制系统设计  

Design of Control System for Multi-chip High-precision Die-bonding Equipment

作　　者：马轶博 丁宇心 段晋胜 MA Yibo;DING Yuxin;DUAN Jinsheng(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《科技创新与生产力》2024年第7期91-93,共3页Sci-tech Innovation and Productivity

摘　　要：本文指出固晶是集成电路半导体后道封装工艺中的重要环节,作为该工艺的实现设备,高精度固晶机对半导体后道封装产品的良品率起着至关重要的作用。国内现有高精度固晶机多为进口设备,存在交货周期长、售后服务不到位且存在随时对中国禁运的风险,针对以上问题,中国电子科技集团公司第二研究所自主研制的多芯片高精度固晶机,实现了高精度固晶贴片设备的自主可控。本文重点阐述多芯片高精度固晶机的控制系统设计。This paper points out that die-bonding is an important link in the back-channel packaging process of integrated circuit semiconductor.As the realization equipment of this process,high-precision die-bonding machine plays a crucial role in the yield of semiconductor back-channel packaging products.Most of the existing high-precision die-bonding machines in China are imported equipment,and there is a long delivery cycle,after-sales service is not in place and there is the risk of embargo to China at any time.In response to the above problems,The 2nd Research Institute of CETC independently developed a multi-chip high-precision die-bonding machine to achieve the autonomy and control of high-precision die-bonding chip equipment.This paper focuses on the control system design of multi-chip high-precision die-bonding machine.

关 键 词：多芯片 高精度 固晶 运动控制器 上位机 

分 类 号：TP391.41[自动化与计算机技术—计算机应用技术]