碲化铋基热电器件的界面研究进展  

Research Progress on Interface of Bismuth Telluride-Based Thermoelectric De⁃vices

作　　者：武云笑 夏凯阳 胡惠平 张宇 付晨光[1] 朱铁军[1,2] WU Yunxiao;XIA Kaiyang;HU Huiping;ZHANG Yu;FU Chenguang;ZHU Tiejun(School of Materials Science and Engineering,Zhejiang University,Hangzhou 310058,China;Institute of Wenzhou,Zhejiang University,Wenzhou 325035,China)

机构地区：[1]浙江大学材料科学与工程学院,浙江杭州310058 [2]浙江大学温州研究院,浙江温州325035

出　　处：《铜业工程》2024年第3期31-39,共9页Copper Engineering

基　　金：国家重点研发计划项目(2023YFB3809400);浙江省自然科学基金委重大项目(LD22E020005)资助。

摘　　要：热电转换技术是一种直接将电能和热能相互转换的技术,在航空航天、新型能源、电子通信等领域具有重要的应用价值。碲化铋材料是最早被发现的半导体热电材料之一,它在室温附近所展现出的优异热电性能,使碲化铋基热电器件成为目前唯一成功商业化应用的热电器件。近年来,随着5G光通信和电子芯片行业对新型制冷技术需求的持续增长,热电制冷器件的应用备受瞩目。此外,碲化铋基发电器件在低温废热回收领域也具有巨大的应用前景。然而,碲化铋基热电器件发展仍然存在一些挑战,其中器件的界面问题严重制约了其产业化应用。尤其在发电器件制备方面,仍然缺乏有效的高温界面阻挡层材料。本文从碲化铋基热电器件应用面临的界面问题出发,重点介绍相关界面研究进展,阐述界面对器件性能的影响机制,并分析改善界面性能的有效策略。Thermoelectric conversion technology can realize direct inter-conversion between electricity and thermal energy,holding sig⁃nificant application value in fields such as aerospace,new energy,and electronic communications.Bismuth telluride material is one of the earliest semiconductor thermoelectric materials discovered,and its excellent thermoelectric properties near room temperature make bismuth telluride-based thermoelectric devices the only thermoelectric devices that have been successfully commercialized so far.In re⁃cent years,the application of thermoelectric cooler has attracted much attention as the demand for new refrigeration technologies in the 5G optical communications and electronic chip industries continues to grow.In addition,bismuth telluride-based thermoelectric generator has great application prospects in the field of low-temperature waste heat recovery.However,there are still some challenges in the development of bismuth telluride-based thermoelectric devices,and the interface problems of the devices seriously restrict their indus⁃trial application.Especially in the preparation of thermoelectric generator,there is still a lack of effective high-temperature interface barrier material.This review focused on the interface problems faced in the application of bismuth telluride-based thermoelectric devic⁃es,highlighted the progress of related interface research,explained the mechanism of the interface's influence on the performance of the devices,and analyzed the effective strategies to improve the interface performance.

关 键 词：热电器件 界面性能 界面接触电阻 界面结合强度 扩散阻挡层 

分 类 号：TN337[电子电信—物理电子学]