铜基板面积、焊锡和导电铜箔厚度对高功率密度LED极限光电性能的影响  

Influence of Copper Substrate Area,Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs

作　　者：黄林凤 熊传兵 汤英文 袁慧 马依豪 杨欣雨 HUANG Linfeng;XIONG Chuanbing;TANG Yingwen;YUAN Hui;MA Yihao;YANG Xinyu(School of Physics and Information Engineering,Minnan Normal University,Zhangzhou 363000,China)

机构地区：[1]闽南师范大学物理与信息工程学院,福建漳州363000

出　　处：《发光学报》2024年第7期1196-1210,共15页Chinese Journal of Luminescence

基　　金：福建省技术创新重点攻关及产业化项目(2023QX007);福建省高校产学合作科技计划项目(2023H6018)。

摘　　要：高功率密度LED器件能实现传统光源和普通LED器件无法实现的诸多功能,将半导体照明技术链推向了一个崭新的高度。在实际应用中,单颗LED器件需要在数百瓦及近100 A电流下工作,铜基板面积、焊锡和导电铜箔厚度均会对该类型LED器件的极限光电性能这一关键指标产生显著影响。本文将单颗极限电功率为300 W和200 W的两种规格的LED蓝光和白光器件,分5μm、100μm和200μm三个焊锡厚度,分别贴片焊接在直径为20 mm、25 mm和32 mm三种不同面积的热电分离铜凸台基板上,测试了当散热器温度分别为25℃、50℃、75℃和100℃时蓝光LED器件光功率、白光LED光通量及其灯板导线焊点间的电压随电流的变化。同时,还研究了铜基板的导电铜箔厚度分别为70μm和140μm时,极限电功率为150 W的蓝光LED器件的I-L特性和I-V特性,并对其极限发光进行了研究。研究结果表明,焊锡厚度、铜基板面积和导电铜箔厚度均会对LED的极限发光强度和工作电压产生明显影响;减小焊锡厚度和增加铜基板面积能显著提高高功率LED器件的极限光强,P110和T90两种规格蓝光LED器件极限光功率的提升幅度高达16%和19%,白光器件极限光通量的提升幅度均高达15%左右;当铜箔厚度由70μm增加到140μm、散热器温度为25℃时,P70蓝光LED的极限光功率提升幅度为9.2%,50℃和75℃时极限光功率提升幅度为12.9%,100℃时极限光功率提升幅度为16.4%。High power density LED device can achieve many functions that is the traditional light sources and ordinary LED devices cann’t achieve,and it is pushing the LED lighting industry technology chain into a new level.In practical applications,the high power density LED needs to work at hundreds of watts and nearly 100 A current.The copper sub⁃strate area,solder tin and copper foil thickness will have a significant effect on the maximum light intensity,it is the most important indicator of this type LED.In this paper,we have welded the LEDs(300 W and 200 W,blue and white light)onto the thermoelectric separation copper substrates(Three diameters of the substrate:32 mm,25 mm,20 mm.Three solder tin thicknesses between the LED and the substrate:5μm,100μm,200μm).The I-L and I-V curves of the blue and white light LEDs have been tested,under different radiator temperatures(25℃,50℃,75℃and 100℃,respectively).The I-L and I-V characteristics of the blue light LED devices with a maximum electrical power of 150 W were also studied when the conductive copper foil thickness of the copper substrate was 70μm and 140μm,respec⁃tively.And its maximum optical output was studied.The research results indicate that the thickness of solder tin,the area of copper substrate,and the thickness of conductive copper foil all have significant effects on the maximum luminous intensity and operating voltage of the LEDs.The decrease of solder thickness and the increase of copper substrate area can significantly improve the maximum light intensity of the LEDs,the increase of maximum blue light optical power of the P110 and T90 LEDs can reach up to 16%and 19%,the increase of the maximum luminous flux of the white light LEDs is about 15%,respectively.When the thickness of the copper foil increases from 70μm to 140μm,the maximum optical power increase of P70 blue LED is 9.2%when the heat sink temperature is 25℃,12.9%at 50℃and 75℃,and 16.4%at 100℃.

关 键 词：高功率密度LED 热电分离铜凸台基板 焊锡 导电铜箔 

分 类 号：TN304[电子电信—物理电子学]