MLCC手工焊接质量控制研究  

Research on Quality Control of MLCC Manual Welding

作　　者：杜琳琳 李龙 金洪斌 韩汶洪 姚钰钰 徐琴 DU Linlin;LI Long;JIN Hongbin;HAN Wenhong;YAO Yuyu;XU Qin(Chengdu Hongke Electronic Technology.,Chengdu 610100,China;Aeronautics Computing Technique Research Institute,Xi’an 710065,China)

机构地区：[1]成都宏科电子科技有限公司,四川成都610100 [2]中国航空工业集团公司西安航空计算技术研究所,陕西西安710065

出　　处：《电子质量》2024年第7期25-30,共6页Electronics Quality

摘　　要：针对多层瓷介电容器(MLCC)在手工焊接过程中可能引入的裂纹损伤从而降低其使用可靠性的问题开展了研究。探索了手工焊接过程中MLCC外形尺寸、印制电路板(PCB)是否预热、焊盘散热速率和焊接温度对MLCC裂纹的影响程度,摸索最优焊接工艺参数,尽可能消除MLCC应用过程中可能引入裂纹损伤的质量隐患,进一步确保MLCC的使用可靠性。The problem of the reduce of use reliability of multilayer ceramic capacitor(MLCC)due to possible crock damage during manual welding is studied.The influence of MLCC dimensions,PCB preheating,pad heat dissipation rate and welding temperature on the cracks of MLCC in the manual welding process is explored,and the optimal welding process parameters are explored,so as to eliminate quality hazards of possible crack damage in the application process of MLCC as much as possible,and further ensure its use reliability.

关 键 词：多层瓷介电容器 手工焊接 焊接质量 外形尺寸 预热 散热速率 温度 最优工艺参数 

分 类 号：TG441.7[金属学及工艺—焊接] TB114.37[理学—概率论与数理统计]