无卤覆铜板基材的耐导电阳极丝迁移研究  

Research on the Anti Conductive Anodic Filament Migration in Halogen-free Copper Clad Laminate Substrate

作　　者：胡朝辉 HU Chaohui(CEPREI,Guangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子质量》2024年第7期35-39,共5页Electronics Quality

摘　　要：导电阳极丝(CAF)迁移作为印制电路板的一种失效模式,已经对电子产品造成了无数灾难性的损坏。随着现在电子产品中的电路越来越密集,电路板镀覆孔的间距也越来越小,因此电子产品CAF失效的案例数量显著地上升。近年来含卤素的电子材料逐步禁用,将无卤的FR-4基材与含卤的FR-4基材进行了对比评估。两种类型的试样分别使用无卤基材和含卤基材,通过环境试验加速CAF生长直至失效。通过对失效样品的对比研究分析,得知封装基材内玻纤和树脂的结合能力是决定CAF生长速度的根本原因,该结果意味着在使用无卤基材替代含卤基材时必须谨慎,若想避免细间距线路基材发生CAF失效,必须提高封装基材中的玻纤与树脂的结合力。Conductive anodic filament(CAF)migration is a failure mode of printed circuit boards,and it has caused countless catastrophic damages to electronic products.With the increasing density of circuits in electronic products,the spacing between circuit board plating holes is also decreasing,resulting in a significant increase in the number of cases of CAF failure in electronic products.In recent years,electronic materials containing halogens have gradually been banned.A comparative evaluation is conducted between halogen-free FR-4 substrates and halogen-containing FR-4 substrates.The two types of specimens use halogen-free substrate and halogen-containing substrate respectively,and environmental test are carried out to accelerate the growth of CAF until product failure.Through comparative research and analysis of failed samples,it is found that the bonding ability between glass fibers and resin inside the packaging substrate is the fundamental reason that determines the growth rate of CAF.This result means that caution must be exercised when replacing halogen-containing substrates with halogen-free substrates.To avoid CAF failure of fine pitch circuit substrates,it is necessary to improve the bonding strength between glass fibers and resin in the packaging substrate.

关 键 词：覆铜板 导电阳极丝 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学] TB114.37[理学—概率论与数理统计]