机器人主板QFN上锡不良失效案例分析  

Case Analysis of Defective Tin Failure on QFN Main Board of an Actual Industrial Robot

作　　者：朱建国 李娟 卫能 陆泽通 曾恒[2] ZHU Jianguo;LI Juan;WEI Neng;LU Zetong;ZENG Heng(Wuhu Ceprei Robot Industry Technology Institute Co.,Ltd.,Wuhu 241000,China;School of Mechanical Engineering,Anhui Polytechnic University,Wuhu 241000,China)

机构地区：[1]芜湖赛宝机器人产业技术研究院有限公司,安徽芜湖241000 [2]安徽工程大学机械工程学院,安徽芜湖241000

出　　处：《电工技术》2024年第12期68-71,共4页Electric Engineering

摘　　要：针对机器人主板QFN封装芯片上锡不良问题,通过X-ray分析、表面SEM&EDS分析、截面分析、可焊性测试等手段,分析机器人主板QFN封装芯片上锡失效原因。This paper focuses on the problem of poor soldering on the QFN packaging of robot motherboard chip.Through X-ray analysis,surface SEM&EDS analysis,cross-sectional analysis,and solderability testing,the reasons for the failure of poor soldering on robot motherboard QFN are analyzed.

关 键 词：QFN封装芯片 机器人 主板 失效分析 

分 类 号：TM08[电气工程—电工理论与新技术]