Ga元素对低银系Sn-0.3Ag-0.7Cu焊料合金性能的影响  

Effect of Ga element on the properties of low silver Sn-0.3Ag-0.7Cu solder alloy

作　　者：徐深深 徐冬霞[1,2] 郑越 任鹏凯 范晓杰 张红霞 XU Shenshen;XU Dongxia;ZHENG Yue;REN Pengkai;FAN Xiaojie;ZHANG Hongxia(School of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo 454003,Henan Province,China;Jiaozuo Green Welding Engineering Technology Research Center,Jiaozuo 454003,Henan Province,China;School of Mechanical Engineering,Guizhou Institute of Engineering and Applied Technology,Bijie 551700,Guizhou Province,China;Luoyang Landi Glass Machinery Co.,Ltd.,Luoyang 471000,Henan Province,China)

机构地区：[1]河南理工大学材料科学与工程学院,河南焦作454003 [2]焦作市绿色焊接工程技术研究中心,河南焦作454003 [3]贵州工程应用技术学院机械工程学院,贵州毕节551700 [4]洛阳兰迪玻璃机器股份有限公司,河南洛阳471000

出　　处：《电子元件与材料》2024年第6期685-693,共9页Electronic Components And Materials

基　　金：河南省产学研合作项目(152107000077);河南省高校基本科研业务费专项资金资助(NSFRF200404);贵州省教育厅青年科技人才成长项目(黔教合KY字[2020]160)。

摘　　要：为改善SAC0307焊料合金的综合性能,在钎料中引入Ga元素。通过DSC、润湿铺展实验、拉伸试验、SEM、EDS以及XRD等手段探究不同质量分数Ga元素对Sn-0.3Ag-0.7Cu-xGa(x=0,0.2%,0.4%,0.6%,0.8%,1.0%)系焊料合金综合性能的影响。结果表明:Ga元素对低银系Sn-0.3Ag-0.7Cu-xGa焊料合金熔化温度以及熔程影响较小;Ga元素能够提高焊料合金的润湿性能,当Ga元素添加质量分数为0.6%时,焊料合金铺展率最大为67.55%,抗拉强度最大为40.18 MPa,这是由于焊料金属间化合物组织由长条状转化为不规则块状,细化程度最高;当Ga元素质量分数为0.8%时,增重比为0.21%,焊料合金的抗氧化性能最好,但只比质量分数为0.6%时少0.02%。因此根据焊料合金的综合性能确定Sn-0.3Ag-0.7Cu-xGa(x=0.6%)配方为最佳。Ga element was introduced into solder material to improve the comprehensive performance of SAC0307 solder alloy.The effects of Ga addition on the comprehensive performance of Sn-0.3Ag-0.7Cu-xGa(x=0,0.2%,0.4%,0.6%,0.8%,1.0%)solder alloys were investigated by DSC,wetting and spreading experiments,tensile tests,SEM,EDS and XRD.The results show that Ga element has trivial effect on the melting temperature and melting range of the low silver Sn-0.3Ag-0.7Cu-xGa solder alloy.At Ga mass fraction of 0.6%,the wettability of the solder alloy is improved obviously,and the spreading rate of the solder alloy can reach up to 67.55%,and the tensile strength can reach up to 40.18 MPa.The improvement could be attributed to the transformation of the microstructure of the intermetallic compound from long strip to elongated strip and the better refinement of the grain size.The optimal antioxidant performance of the solder alloy can be obtained at the Ga element mass fraction of 0.8%with weight gain ratio of 0.21%,which is roughly equivalent to that of 0.6%.Therefore,Sn-0.3Ag-0.7Cu-xGa(x=0.6%)is the optimum solder alloy according to the comprehensive performance.

关 键 词：焊料合金 熔化特性 润湿性 微观组织 力学性能 抗氧化性 

分 类 号：TG425.1[金属学及工艺—焊接]