封装基板技术在微电子产品中的应用  

Application of Packaging Substrate Technology in Microelectronic Products

作　　者：张凤 ZHANG Feng(Nanjing Weimeng Electronics Co.,Ltd.,Jiangsu 210023,China)

机构地区：[1]南京微盟电子有限公司,江苏210023

出　　处：《集成电路应用》2024年第6期8-9,共2页Application of IC

摘　　要：阐述封装基板的特点,刚性基板和柔性基板在材料、性能方面的区别,并选取FCBGA基板、无芯基板以及埋嵌芯片技术作为分析对象,详细分析封装基板技术在微电子产品中的实际应用。This paper describes the characteristics of packaging substrates,the differences in materials and properties between rigid and flexible substrates,and selects FCBGA substrates,coreless substrates,and embedded chip technologies as the analysis objects to analyze in detail the practical application of packaging substrate technology in microelectronic products.

关 键 词：封装基板技术 刚性基板 柔性基板 FCBGA基板 无芯基板 埋嵌芯片技术 

分 类 号：TN405[电子电信—微电子学与固体电子学]