高温高压应用环境下陶瓷外壳设计加工及可靠性评估  

Design Processing and Reliability Evaluation of Ceramic Shells under High Temperatures and Pressures

作　　者：刘文辉 LIU Wenhui(Xidian University,Xi’an 710068,P.R.China;ShaanXi Electronic XinYe ShiDai Co.,Ltd.,Xi’an 710000,P.R.China)

机构地区：[1]西安电子科技大学,西安710068 [2]芯业时代科技有限公司,西安710000

出　　处：《微电子学》2024年第2期304-310,共7页Microelectronics

摘　　要：为满足碳化硅二极管在高温(大于200℃)、高压(大于20 kV)环境下的应用需求,采用注浆成型的陶瓷加工工艺制作了一款三腔室外壳。与传统塑料封装相比,陶瓷外壳提高了器件的工作温度和绝缘耐压特性,发挥了碳化硅材料的高温应用优势。针对高低温循环试验后因材料形变导致陶瓷外壳开裂的问题,使用Ansys软件仿真了温度变化导致的结构应力,并优化了外壳隔墙结构,优化后的外壳结构通过了环境应力试验。参照此结构可以采用单腔室、双腔室、多腔室的结构开发出不同电压等级外壳。同样,参照此结构可以采用不同大小的腔室开发出不同正向整流能力的外壳。To solve the application demand of silicon carbide diodes in high temperature(>200℃)and high voltage(>20 kV)environments,we fabricated a three-chamber shell using a ceramic processing technology of injection molding.Compared with traditional plastic sealing material,the ceramic shell significantly improves the working temperature and insulation voltage resistance characteristics of the device and can be used for high-temperature applications of silicon carbide materials.To solve the problem of shell cracking caused by material deformation after the temperature cycle test,we used ANSYS software to simulate the structural stress caused by temperature change and optimize the shell partition structure.The optimized shell structure passed the environmental stress test.With this structure,shells of different voltages can be developed with single-,double-,and multi-chamber structures.Similarly,shells with different forward rectification capabilities can be developed using different chamber sizes.

关 键 词：碳化硅 陶瓷 整流器 硅堆 超高压 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]