空腔结构硅基载板封装的机械应力分析  

Mechanical Stress Analysis of a Cavity Structure Silicon⁃based Substrate Package

作　　者：李岚清 石先玉 孙瑜 万里兮 张先荣[2] 张睿 陆宇 LI Lanqing;SHI Xianyu;SUN Yu;WAN Lixi;ZHANG Xianrong;ZHANG Rui;LU Yu(Chengdu Wanying Microelectronics Co.,Ltd.,Chengdu,611731,CHN;Southwest China Institute of Electronic Technology,Chengdu,610036,CHN)

机构地区：[1]成都万应微电子有限公司,成都611731 [2]中国西南电子技术研究所,成都610036

出　　处：《固体电子学研究与进展》2024年第3期245-251,共7页Research & Progress of SSE

摘　　要：基于硅基载板与芯片之间良好的热膨胀系数匹配性和硅通孔的高密度互联特性,硅基载板广泛应用于高集成度、高可靠微系统封装中。封装产品在工作过程中需要经受外界不同的加速度、随机振动、机械冲击以及环境温度变化、器件工作发热等引起的热应力,这些应力均可能引起封装发生分层、断裂等失效。因此,很有必要预测外界环境对封装可靠性的影响。本文以典型硅基载板封装为例,采用数值仿真方法研究封装在使用过程中外界机械应力和热应力对其可靠性的影响。结果表明,热应力对封装的变形和应力影响最大;随机振动频率50~2000 Hz范围和功率谱密度为4(m·s^(-2))^(2)/Hz内,封装不会产生共振失效;机械冲击载荷对封装影响最小。实际封装产品经过机械冲击和随机振动等试验验证,满足设定的使用要求。The widespread use of silicon-based substrates in highly integrated and reliable micro⁃system packaging is due to the good matching of the coefficient of thermal expansion between the sili⁃con substrate and the chip,coupled with the high-density interconnection characteristics of through-sili⁃con vias.The packaged product must be able to withstand a variety of external stresses,including ac⁃celeration,vibration,shock,temperature change,and heating induced stresses,during operation.Failures of the package such as delamination and fracture may occur owing to these stresses.Thus,there was a necessity to predict the influence of the external environment on package reliability.In this paper,numerical simulation techniques were employed to investigate the impact of external mechani⁃cal and thermal stresses on the reliability of a typical silicon-substrate package during operation.The results indicate that thermal stress exerts the most significant influence on the deformation and stress of the package.In the context of a random vibration frequency range of 50-2000 Hz and a power spec⁃tral density of 4(m·s^(-2))^(2)/Hz,the package is not susceptible to resonance-induced failure.Further⁃more,mechanical shock loads exhibit a minimal impact on the package.The actual packaged products have been subjected to tests,including mechanical shock and random vibration,to verify that they meet the set requirements in use.

关 键 词：可靠性 硅基载板封装 机械应力 数值仿真 

分 类 号：TN406[电子电信—微电子学与固体电子学]