基于Au/In键合的静电扭转微镜的设计与工艺研究  

Design and Process Study of Electrostatic Torsion Micromirror Based on Au/In Bonding

作　　者：王俊铎 胡钰玮 吴永强 单亚蒙 钱磊 沈文江 WANG Junduo;HU Yuwei;WU Yongqiang;SHAN Yameng;QIAN Lei;SHEN Wenjiang(School of Nano‑tech and Nano‑bionics,University of Science and Technology of China,Hefei,230026,CHN;Key Laboratory of Nanodevices and Applications,Suzhou Institute of Nano‑tech and Nano‑bionics,Chinese Academy of Sciences,Suzhou,Jiangsu,215123,CHN;School of Mechanical Engineering,Xi'an Jiaotong University,Xi'an,710048,CHN)

机构地区：[1]中国科学技术大学纳米技术与纳米仿生学院,合肥230026 [2]中国科学院苏州纳米技术与纳米仿生研究所纳米器件与应用重点实验室,江苏苏州215123 [3]西安交通大学机械学院,西安710048

出　　处：《固体电子学研究与进展》2024年第3期252-257,共6页Research & Progress of SSE

摘　　要：采用Au/In键合技术并引入凸点层设计,制备了用于光通信领域的二维平行板式静电扭转微镜阵列。相较于其他键合技术,Au/In键合实现了低温键合并与硅通孔技术相容。此外,相对于梳齿驱动,采用平行板电容的扭转微镜有助于实现更高的占空比,便于阵列制造。凸点层的设计提升了键合强度,平均键合强度达8.97 MPa。微镜的实测结果与有限元仿真基本一致,内、外轴分别在13.7 V和18.2 V的直流电压下实现了0.7°的机械转角。This research employed Au/In bonding technology and introduced a convex bump lay⁃er design to successfully fabricate a two-dimensional parallel-plate electrostatic torsional micromirror array for applications in the field of optical communication.Compared to other bonding techniques,Au/In bonding achieved low-temperature bonding and was compatible with through silicon via technol⁃ogy.Furthermore,utilizing parallel-plate capacitive actuation,as opposed to comb-drive actuation,fa⁃cilitated achieving a higher duty cycle,making array manufacturing more convenient.The design of the convex bump layer enhanced bond strength significantly,resulting in an average bond strength of 8.97 MPa.Experimental results of the micromirror closely match finite element simulations,with the inner and outer axis achieving a mechanical rotation angle of 0.7°under direct current voltages of 13.7 V and 18.2 V,respectively.

关 键 词：微镜 Au/In键合 平行板静电驱动 微机电系统 

分 类 号：TN402[电子电信—微电子学与固体电子学]