PCB填孔电镀盲孔单点漏填的改善  

Improvement of single blind hole omission in via filling plating for PCB

作　　者：孙亮亮 席道林 万会勇 刘彬云 SUN Liangiang;XI Daoin;WAN Huiyong;LIU Binyun(Guangdong Toneset Science&Technology Co.,Ltd.,Guangzhou 510288,Guangdong,China;Guangdong Guanghua Science&Technology Co.,Ltd.,Shantou 515061,Guangdong,China)

机构地区：[1]广东东硕科技有限公司,广东广州510288 [2]广东光华科技股份有限公司,广东汕头515061

出　　处：《印制电路信息》2024年第8期41-44,共4页Printed Circuit Information

基　　金：广东省重点领域研发计划资助(2023B0101040002)。

摘　　要：针对填孔电镀中遇到的一种盲孔单点漏填的问题,进行了深入的分析研究,通过对比验证,找出了问题的根源。结果表明:单点漏填的原因是异物阻镀,而异物来自于前处理导条的包胶材料,将其拆除后问题得到解决。This article conducts in-depth analysis and research on the problem of single blind hole ommission in via filling plating.Through comparative verification,the root cause of the problem is identified.The results show that the omission of filling of single blind hole is caused by foreign objects obstructing the plating,and the foreign objects come from the adhesive material of the pre-treatment guide strip.After the pre-treatment guide strip is removed,the problem is solved.

关 键 词：印制电路板 填孔电镀 盲孔 漏填 

分 类 号：TN41[电子电信—微电子学与固体电子学]