一种5G基站用PCB的压合填孔研究  

Research on pressing fill holes of a PCB for 5G base stations

作　　者：周明吉 周军林 曹小冰 杨展胜 白冬生 ZHOU Mingji;ZHOU Junin;CAO Xiaobing;YANG Zhansheng;BAI Dongsheng(Zhuhai Founder Technology High Density Electronic Co.,Ltd.,Zhuhai 510310,Guangdong,China)

机构地区：[1]珠海方正科技高密电子有限公司,广东珠海510310

出　　处：《印制电路信息》2024年第8期53-57,共5页Printed Circuit Information

摘　　要：在5G基站56 bps主板设计中,常用到高频材料与高速材料混压的M+2结构。针对M+2结构的印制电路板(PCB),在常规生产工艺中的二次压合之前,需要先使用树脂塞孔将2个子板的过孔填实。但树脂塞孔流程长,且子板叠构不对称,板翘影响其他工序加工。主要介绍一种半固化片(PP)三明治塞孔工艺替代树脂塞孔工艺,对于M+2钻带结构的板,使用本工艺时,子板在二次压合前,盲孔不需要做树脂塞孔。在二次压合的时候,直接使用PP填孔,既能保证填孔的饱满度、各项PCB品质要求,又能减少流程,降低加工成本,并且还能大幅度提升生产效率。In the design of 56 bit/s motherboard of 5G base station,the design of M+2 with hybrid of high frequency material and high speed material is commonly used.For the conventional production process of the printed circuit board(PCB)with M+2 design,before the final lamination process of two sub-PCBs,it is necessary to use epoxy to plug holes of the two sub-PCBs.However,the epoxy plugging process is very time consuming,the stack-up is asymmetrical,and the board warpage affects other post processes.This paper mainly introduces a prepreg(PP)sandwich plugging process instead of the epoxy plugging process.For the board with the structure of M+2 design,this process does not need to make epoxy plugging holes before the second lamination.At the time of secondary lamination,we use PP to fill the holes can not only ensure the fullness of the hole,ensure the quality requirements of the PCB,but also reduce the processes and costs,and improve the production efficiency a lot.

关 键 词：高速印制电路板 M+2设计 树脂塞孔 半固化片塞孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]