氧化铝陶瓷金属化的界面性能  

Interface Performances of Alumina Ceramic Metallization

作　　者：淦作腾[1] 杨梦想 刘林杰[1] 杨德明 Gan Zuoteng;Yang Mengxiang;Liu Linjie;Yang Deming(The 13^(th) Research Institute,CETC,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《微纳电子技术》2024年第8期32-38,共7页Micronanoelectronic Technology

摘　　要：金属/陶瓷界面性能是陶瓷基板应用可靠性的重要影响因素。为了得到均匀致密且结合良好的金属/陶瓷界面,以丝网印刷方式制作了基材为Al_(2)O_(3)的钨金属化层,通过调整钨金属化浆料中无机氧化物Al_(2)O_(3)粉的质量分数,研究了无机氧化物内不同Al_(2)O_(3)质量分数对金属化层微观形貌、金属化层与陶瓷结合强度的影响,并探究了金属化层的烧结机理。结果显示:金属化层主要由金属骨架与玻璃相组成,其与陶瓷基体的结合强度与Al_(2)O_(3)质量分数呈现出强相关性。实验表明,无机氧化物中Al_(2)O_(3)质量分数为90%时拉力最大,为29.1N,相较于质量分数为20%时提升50%以上。在无机氧化物总占比相同的条件下,不同Al_(2)O_(3)质量分数对浆料印刷性能和方阻影响较小。研究结果为氧化铝陶瓷金属化的制作与应用提供了参考。The interface performances between metal and ceramic are the important factors affecting the reliability of ceramic substrate applications.In order to obtain a uniform,dense and well bonded ceramic/metal interface,a tungsten metallized layer with Al_(2)O_(3) as substrate was made by screen printing.By adjusting the mass fraction of inorganic oxide Al_(2)O_(3) powder in tungsten metallized paste,the influences of different Al_(2)O_(3) mass fractions in inorganic oxide on the micromorphology of the metallized layer,the bonding strength between metallized layer and ceramic were studied,and the sintering mechanism of the metallized layer were investigated.The results show that the metallized layer is mainly composed of the metal skeleton and glass phase,and the bonding strength between the metallized layer and the ceramic matrix is strongly correlated with the Al_(2)O_(3) mass fraction.The experiment indicates that the tensile force reaches a maximum of 29.1 N when the Al_(2)O_(3) mass fraction in inorganic oxide is 90%,which is more than 50% higher than that of 20%.Under the condition that the total proportion of inorganic oxide is the same,different Al_(2)O_(3) mass fractions has little effect on the printing performance and the square resistance of the paste.The research results provide a reference for the fabrication and application of alumina ceramic metallization.

关 键 词：金属化 陶瓷界面 结合强度 微观形貌 方阻 

分 类 号：TN304.82[电子电信—物理电子学]