深度潜水仪用HDI板金属化槽掩孔技术研究  

Research on metallized slot mask technology of HDI PCB for deep diving instrument

作　　者：王斌 唐宏华 樊廷慧 徐得刚 Wang Bin;Tang Honghua;FanTinghui;Xu Degang

机构地区：[1]惠州市金百泽电路科技有限公司,广东惠州516083 [2]深圳市金百泽电子科技股份有限公司,广东深圳518000

出　　处：《印制电路资讯》2024年第4期82-84,共3页Printed Circuit Board Information

摘　　要：该类型PCB产品主要应用于深度潜水仪设备,常规潜水仪设备下潜深度一般为50米,该产品经过特殊设计可满足水下150米的深度摄像,此类产品需要设计金属化包边制作且线宽线距≤50μm/50μm,因此按现有常规加工技术无法满足此类型产品的加工要求。本文主要采取对加工工艺及加工流程创新优化,既能满足精细线路加工,亦能显著提升金属化槽的掩孔能力,从而满足深度潜水仪金属化槽HDI板的批量化生产。This type of PCB product is mainly used in deep diving equipment,the diving depth of conventional diving equipment is generally 50 meters,the product is specially designed to meet the depth of 150 meters,such products need to be designed to be made of metallization edging and line width and line spacing≤50μm/50μm,so the existing conventional processing technology can not meet the processing requirements of this type of product.In this paper,the processing technology and processing process are innovated and optimized,which can not only meet the fine line processing,but also significantly improve the hole covering ability of the metallization slot,so as to meet the mass production of HDI board in the metallization slot of the deep diving instrument.

关 键 词：HDI 金属化槽 图形转移 精密线路 

分 类 号：TN4[电子电信—微电子学与固体电子学]