基于硅基载板微系统封装的散热结构研究  

Heat Dissipation Structure Based on Microsystem Packaging on a Silicon Substrate

作　　者：张先荣[1] 张睿 陆宇 李岚清 石先玉 孙瑜 李克忠 万里兮 ZHANG Xianrong;ZHANG Rui;LU Yu;LI Lanqing;SHI Xianyu;SUN Yu;LI Kezhong;WAN Lixi(Southwest China Institute of Electronic Technology,Chengdu 610036,P.R.China;Chengdu Wanying Microelectronics Co.,Ltd.,Chengdu 611731,P.R.China)

机构地区：[1]中国西南电子技术研究所,成都610036 [2]成都万应微电子有限公司,成都611731

出　　处：《微电子学》2024年第3期492-497,共6页Microelectronics

摘　　要：基于硅基载板与芯片之间有良好的热膨胀系数匹配性能和硅通孔(TSV)有高密度的互联技术特性,硅基载板广泛应用于高集成度、高可靠微系统封装。然而射频链路中存在较大的发热,可能导致芯片高温时无法正常工作,同时在封装内部产生较大的热应力,可能引起分层、互联失效等可靠性问题,因此硅基载板封装系统的散热设计至关重要。文章以典型硅基载板封装为例,采用数值仿真方法,研究A型(PCB板)、B型(PCB+铜板)和C型(PCB+铜板+散热翅片)3种散热结构和不同对流工况对封装内部芯片散热的影响,并与原始封装散热效果作对比。研究结果表明,改变外流场速度从而增大封装与外流场的换热系数、增大封装散热面积、提高封装的导热系数均可改善硅基封装的散热效率;最佳散热结构和工况为强迫对流工况下的C型结构。Based on the good matching performance of the thermal expansion coefficient between a silicon substrate and a chip and the high-density interconnection technology characteristics of a through-silicon via(TSV),silicon substrates are widely used in high-integration and high-reliability microsystem packaging.However,the presence of large amounts of heat in the RF link may affect the normal functioning of the chip at high temperatures and cause reliability problems such as delamination and interconnection failure.Therefore,the heat dissipation design of the silicon substrate packaging system is very important.In this study,considering a typical silicon substrate package as an example,the effects of three heat dissipation structures and different convection conditions on the heat dissipation of the chip inside the package are investigated using numerical simulation methods.Additionally,the heat dissipation effects of the three types of A,B,and C structures(PCB,PCB & copper board & heatsink) are compared with those of the original package.The results show that the heat dissipation efficiency of silicon-based packaging can be improved by increasing the heat exchange coefficient between the package and the external flow field,increasing the heat dissipation area of the package,and increasing the thermal conductivity of the package.This study demonstrates that the optimal heat dissipation structure and working conditions are type C(PCB & copper board & heatsink) under forced convection conditions.

关 键 词：硅基载板 硅基通孔 散热分析 数值仿真 

分 类 号：TN305.94[电子电信—物理电子学]