超高压玻封二极管玻璃体开裂的原因及工艺优化研究  

Glass Cracking and Process Optimization of Ultra-high-voltage Glass-sealed Diodes

作　　者：刘文辉 LIU Wenhui(Xidian University,Xi’an 710068,P.R.China;ShaanXi Electronic XinYe ShiDai Co.,Ltd.,Xi’an 710000,P.R.China)

机构地区：[1]西安电子科技大学,西安710068 [2]芯业时代科技有限公司,西安710000

出　　处：《微电子学》2024年第3期498-502,共5页Microelectronics

摘　　要：围绕超高压二极管在环境应力作用下玻璃体开裂问题,结合玻璃粉的材料特性,对特定型号玻璃粉采用不同烧结曲线进行试验,发现增加恒温区烧结时间、减小降温速率,可提高玻璃体韧性;对特定型号的玻璃粉进行二次研磨后再烧结,玻璃体中的沙眼和气泡大幅减小。采用上述工艺制作的超高压二极管样品通过了高温储存、高低温冲击等环境应力试验。Aiming at the glass cracking in ultra-high-voltage sealed diodes under environmental stress and combining the material characteristics of glass powder,experiments were conducted on specific types of glass powder using different sintering curves.The glass transition and crystallization temperature characteristics of glass powder were studied.Through experiments using different sintering curves for specific types of glass powder,the toughness of the glass was improved by increasing the sintering time in the constant temperature zone and reducing the cooling rate.A significant reduction in sand holes and bubbles in the glass was obtained through secondary grinding on the selected model of glass powder.The ultra-high-voltage sealed diode samples produced using the above process passed environmental stress tests such as high temperature storage and high/low temperature impacts.

关 键 词：超高压二极管 玻璃烧结 玻璃开裂 玻璃钝化 

分 类 号：TN406[电子电信—微电子学与固体电子学]