电铸液喷射速度对电铸铜微观组织及力学性能的影响  

Effect of Injection Speed on Microstructure and Mechanical Properties of Electroforming Copper

作　　者：沈志豪 朱增伟[1] 詹晓非 SHEN Zhihao;ZHU Zengwei;ZHAN Xiaofei(College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)

机构地区：[1]南京航空航天大学机电学院,江苏南京210016

出　　处：《机械制造与自动化》2024年第4期20-23,53,共5页Machine Building & Automation

基　　金：国家自然科学基金项目(52275436)。

摘　　要：为了制备性能良好的电铸层,使用扫描喷射的方法进行电铸试验,研究喷射速度对电铸铜力学性能和截面微观组织形貌的影响。结果表明:低喷射速度下铜铸层的力学性能没有明显增强,但延伸性得到一定提高;而在高喷射速度下铜铸层的强度和硬度得到显著提升,同时晶粒尺寸得到均匀细化,晶粒取向更为一致。在8.3 m/s喷射速度下,铜电铸层的抗拉强度达到448 MPa。In order to prepare electroforming copper with good performance,the scanning jet process was applied to conduct electroforming for studying the effect of jet speed on the mechanical properties and cross-sectional microstructure of electroforming copper.The results show that the mechanical properties of the electroforming copper are not significantly enhanced at low injection speeds,but the elongation is optimized to a certain extent.The strength and hardness of the electroforming copper are greatly improved at a high injection speed,while the grain size is uniform and refined,and the grain orientation is more consistent.At the jet speed of 8.3 m/s,the tensile strength of the electroforming copper reaches 448 MPa.

关 键 词：电铸 喷射速度 微观组织 力学性能 

分 类 号：TH16[机械工程—机械制造及自动化]