BMS电路板多模块协同热-力耦合建模及仿真分析  

Thermal-stress Coupling Modeling and Simulation Analysis of Multiple Modules in BMS Circuit Board

作　　者：何莉萍[1,2] 原江鑫 李耀东 HE Liping;YUAN Jiangxin;LI Yaodong(State Key Laboratory of Advanced Design and Manufacturing Technology for Vehicle,Hunan University,Changsha 410082,China;College of Mechanical and Vehicle Engineering,Hunan University,Changsha 410082,China;Hunan Central South Intelligent Equipment Co.,Ltd.,Changsha 410117,China)

机构地区：[1]湖南大学整车先进设计制造技术全国重点实验室,湖南长沙410082 [2]湖南大学机械与运载工程学院,湖南长沙410082 [3]湖南中南智能装备有限公司,湖南长沙410117

出　　处：《湖南大学学报（自然科学版）》2024年第8期135-144,共10页Journal of Hunan University:Natural Sciences

基　　金：湖南省重点专项项目(2019GK2191)。

摘　　要：针对现有电动汽车电池管理系统(BMS)电路板研究仅仅考虑单一功能模块的温度场及其散热效果,缺乏考虑BMS多个功能模块在温度场和力场下的相互影响及协同效应的研究的情况,以某商用BMS电路板为研究对象,采用ANSYS构建了表征BMS多模块协同作用下的热-力耦合数值仿真分析模型并验证了其有效性.在此基础上,针对BMS电路板各功能模块温度场及热变形行为开展了数值仿真研究.结果表明:BMS电路板温度分布不均,最大温差达20.5℃.均衡模块存在积热,温度高达54.4℃.高温导致电路板组件发生热膨胀变形,同时电路板约束诱发均衡模块及供电模块边缘的贴片电阻出现热应力集中,两者共同作用致使BMS均衡模块、供电模块产生凸起翘曲变形,且Z轴热变形量随着温度升高而增大,最大变形量达9.5μm,应针对BMS电路板上积热模块开展散热优化设计.In light of the current research on Battery Management System(BMS) circuit boards for electric vehicles,which only takes into account the temperature field and heat dissipation effects of individual functional module but lacks consideration of the interdependence and cooperative effects under the temperature and force fields among multiple functional modules of the BMS,a certain commercial BMS circuit board is taken as the research object,the software ANSYS is used to construct a thermal-stress coupling numerical simulation analysis model that characterizes the synergistic action of multiple BMS modules,and the effectiveness of the model is verified.On this basis,a numerical simulation study was carried out on the temperature field and thermal deformation behavior of each functional module of the BMS circuit board.The results show that the temperature distribution of the BMS circuit board is uneven,and the maximum temperature difference reaches 20.5 ℃.The balancing module generates heat,and the temperature reaches 54.4 ℃,which causes thermal expansion and deformation of circuit board components.At the same time,thermal stress concentration occurs at the chip resistors on the edges of the balancing module and the power supply module due to the circuit board constraint,which causes the balancing module and the power supply module of the BMS to produce protruding and warping deformation.The Z-axis thermal deformation increases with the temperature rising,and the maximum deformation amount reaches 9.5 μm.Therefore,the heat dissipation optimization design should be carried out for the heat-generating modules on the BMS circuit board.

关 键 词：电动汽车 BMS 多模块 温度场 热变形 热-力耦合 仿真分析 

分 类 号：U469.72[机械工程—车辆工程]