液态靶材磁控溅射技术研究进展  

Research Progress on Magnetron Sputtering with Liquid Target

作　　者：王浪平[1] 孙田玮 WANG Langping;SUN Tianwei(Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]哈尔滨工业大学,哈尔滨150001

出　　处：《真空与低温》2024年第5期496-503,共8页Vacuum and Cryogenics

基　　金：中国福建能源器件科学与技术创新实验室开放基金(21C-OP-202210)。

摘　　要：随着先进制造业的迅猛发展,对高性能涂层的需求日益增长。以经济高效的方式沉积高性能涂层成为了科学界研究的热点。液态靶材磁控溅射技术因兼备磁控溅射与蒸镀的优点,受到了研究者的广泛关注。从液态靶材磁控溅射技术的基本原理出发,深入分析了放电过程中的特点与等离子体特性,总结了其特点与优势以及在涂层沉积领域的具体应用,最后指出了该技术当前存在的不足之处,并对其未来的发展趋势进行了展望。With the rapid development of advanced manufacturing technology,the demand for high-performance coat-ings has correspondingly increased.Deposition of high-performance coatings in an economic and efficient way has become a hot topic in scientific research.Due to the advantages of both magnetron sputtering and vapor deposition,the magnetron sput-tering technology of liquid target has been widely concerned by researchers.The underlying principles of liquid target mag-netron sputtering technology is deeply studied.The discharge characteristics and plasma properties of liquid target magnetron sputtering technology are deeply analyzed.The distinctive features and advantages of liquid target magnetron sputtering tech-nology are summarized,and the specific applications in the field of coating deposition is mainly introduced.The current limi-tations of this technology are also pointed out,and its future development trends is prospected.

关 键 词：磁控溅射 液态靶材 薄膜制备 等离子体特性 放电特性 蒸发 高沉积速率 

分 类 号：TG174.444[金属学及工艺—金属表面处理]