塑封集成电路HAST影响因素探讨  

Research on Influencing Factors of HAST of Plastic Encapsulated Integrated Circuits

作　　者：杨永兴[1,2] 张强 侯旎璐 武玉杰 许春强 高海龙 YANG Yongxing;ZHANG Qiang;HOU Nilu;WU Yujie;XU Chunqiang;GAO Hailong(CEPREI-EAST,Suzhou 215000,China;CEPREI,Guangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所华东分所,江苏苏州215000 [2]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子质量》2024年第8期42-47,共6页Electronics Quality

摘　　要：随着塑封集成电路在人工智能、移动互联网、物联网、云计算和大数据等领域的广泛应用,其面临长时间加电连续工作的需求,因此需要对其长期可靠性进行研究。结合试验实例,分别从设备、试验硬件和导线材质等方面对塑封集成电路高加速应力试验(HAST)的影响因素进行了分析。分析结果表明采用高纯水、优化温湿度控制程序可避免凝露引发的集成电路试验过程失效;导电性阳极丝(CAF)和电化学迁移(ECM)是HAST中常见失效问题,试验硬件与工艺需做好CAF和ECM防控;试验线材会影响HAST,线材绝缘层与线芯材质要定期监测,适时更换。With the wide application of plastic encapsulated integrated circuits in artificial intelligence,mobile Internet,Internet of Things,cloud computing,big data and other fields,it faces the demand for long-term power supply and continuous work,so it is necessary to study its long-term reliability.The influence factors of highly accelerated stress test(HAST)of plastic encapsulated integrated circuits are analyzed from the aspects of equipment,test hardware,wire material and so on.The analysis results show that the use of high-purity water and the optimization of temperature and humidity control procedures can avoid the failure of integrated circuit test caused by condensation.Conductive anodic filament(CAF)and electrochemical migration(ECM)are common failure problems in HAST,and the test hardware and technology should be well controlled and prevented from CAF and ECM.The test wires affect HAST,and the insulation layer and core material of wires should be monitored regularly and replaced timely.

关 键 词：塑封集成电路 可靠性 高加速应力试验 影响因素 凝露 试验用水 试验硬件 导线 

分 类 号：TN4[电子电信—微电子学与固体电子学] TB114.37[理学—概率论与数理统计]