大尺寸LTCC焊接组件热变形特性仿真优化设计  

Simulation and Optimization Design of Thermal Deformation Characteristics of Large Size LTCC Welded Components

作　　者：邓超 DENG Chao(The 29th Institute of China Electronics Technology Group Corporation,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子质量》2024年第8期71-75,共5页Electronics Quality

基　　金：国家科技部重点研发计划(2023YFB4603904)资助。

摘　　要：为了研究低温共烧陶瓷(LTCC)基板封装焊接后残余热应力的影响,针对不同温变载荷下LTCC基板的热应力变形进行仿真计算和试验测试,发现仿真结果与试验结果存在一定的偏差,因此,对LTCC焊接组件的有限元模型进行修正。通过LTCC基板与铝合金盒体之间的安装间隙、焊料层厚度的优化,完成LTCC焊接组件热变形特性仿真模型的修正,采用修正后的LTCC焊接组件仿真模型得到的平面度和热应力变形仿真值与试验测量误差均在15%以内。结果表明,LTCC基板、铝合金盒体组成的LTCC基板焊接组件有限元修正仿真模型是正确可行的。In order to study the influence of residual thermal stress after packaging and welding of LTCC substrate,the thermal stress deformation of LTCC substrate under different temperature varying loads is simulated and tested.The results show that there is a certain deviation between the simulation results and the test results.Therefore,the finite element model of LTCC welded components is modified.By optimizing the installation gap between LTCC substrate and aluminum alloy box and the thickness of solder layer,the simulation model of thermal deformation characteristics of LTCC welded components is modified.The flatness and thermal stress deformation simulation values obtained by using the modified LTCC welding module simulation model and the test measurement errors are less than 15%.The results show that the finite element modified simulation model of LTCC substrate welded components composed of LTCC substrate and aluminum alloy box is correct and feasible.

关 键 词：低温共烧陶瓷 热变形仿真 优化设计 

分 类 号：TN405[电子电信—微电子学与固体电子学]