一种基于防振球的光刻机金属包装运输设计  

A Design of Metal Packaging and Transportation for Lithography Machine Based on Anti-vibration Ball

作　　者：刘磊 LIU Lei(Shanghai Micro Electronics Equipment(GROUP)CO.,LTD.)

机构地区：[1]上海微电子装备(集团)股份有限公司

出　　处：《中国集成电路》2024年第8期85-91,共7页China lntegrated Circuit

摘　　要：为解决目前光刻机包装运输中采用木箱和橡胶减振球的结构存在使用周期短,成本高的问题,我们设计了一种基于防振球的光刻机金属运输底板,防振球相比橡胶减振器具有较为明显的成本优势,使金属运输底板设计过程中采用了较为经济的设计方案;同时,我们结合光刻机的特性,通过对基于防振球的金属运输底板静力工况、运输冲击工况及海运中的冲击、摇摆、倾覆工况进行了分析计算,计算结果得出了基于防振球的金属运输底板可用于光刻机的结论。综上看出:一是采用基于防振球的金属运输底板替代现有的木箱包装运输方案,解决了木质包装箱使用周期短的问题,成本高的问题;二是通过对海运工况评估解决了海外光刻机只能采用空运的唯一运输方式,使光刻机运输形式多了一种选择,降低了运输成本。In order to solve the problems of short service cycle and high cost in the structure of wooden box and rub-ber damping ball used in the packaging and transportation of photolithography machine,we designed a metal transport plate based on the anti-vibration ball.The anti-vibration ball has a more obvious cost advantage than the rubber shock absorber,so that a more economical design scheme is adopted in the design process of the metal transport plate.At the same time,we combined the characteristics of the lithography machine,through the analysis and calculation of the metal transport plate based on the anti-vibration ball under static conditions,transport impact conditions and the impact,swing and overturn conditions in the sea,the calculation results reached the conclusion that the metal trans-port plate based on the anti-vibration ball can be used in the lithography machine.To sum up,it can be seen that:first,the metal transport floor based on anti-vibration ball is used to replace the existing wooden box packaging and transportation scheme,which solves the problem of short service cycle and high cost of wooden packing boxes;The second is to solve the problem of overseas lithography machine can only be transported by air through the evaluation of shipping conditions,so that the lithography machine has one more choice in the form of transportation and reduces the transportation cost.

关 键 词：光刻机 防振球 包装运输 冲击 

分 类 号：TN305.7[电子电信—物理电子学] TB485.3[一般工业技术—包装工程]