激光软钎焊系统中半导体激光器温度模型预测控制设计  被引量:1

Design of Temperature Model Predictive Control for Semiconductor Lasers in Laser Soft Soldering System

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作  者:闫宽 张聪 陈绪兵[1] 李明超 方杰 叶冬 Yan Kuan;Zhang Cong;Chen Xubing;Li Mingchao;Fang Jie;Ye Dong(School of Mechanical&Electrical Engineering,Wuhan Institute of Technology,Wuhan 430205,Hubei,China;State Key Laboratory of Intelligent Manufacturing Equipment and Technology,Wuhan 430223,Hubei,China)

机构地区:[1]武汉工程大学机电工程学院,湖北武汉430205 [2]智能制造装备与技术全国重点实验室,湖北武汉430223

出  处:《光学学报》2024年第14期162-168,共7页Acta Optica Sinica

基  金:智能制造装备与技术全国重点实验室开放基金(IMETKF2024025);武汉工程大学研究生教育创新基金(CX2023234)。

摘  要:针对激光软钎焊领域对核心器件半导体激光器的高精度热控要求,提出一种基于模型预测控制算法的热控方法。通过非平衡热力学等方法对热控系统的热电制冷器及部件构建了精准的数学模型,并引入丢番图方程推导模型预测控制热控系统,搭建了激光软钎焊半导体激光器热控实验平台。由随机变换电流输入热控实验结果可知,激光器输入电流变化导致温度波动的平均超调量在1.12%内。激光器中心波长稳定性实验结果表明,所提方法使激光中心波长漂移量减少了52%。激光软钎焊加工能力实验结果表明,该控制方法可以有效控制半导体激光器的输出功率,相比于比例积分微分控制的激光器,所提模型预测控制热控系统的温度曲线与焊点的理想温度曲线的线性拟合度提高了21.05%。该研究结果将为后续研发性能稳定、高质量焊接的激光软钎焊系统提供理论和工程指导。Objective Laser soft soldering in the field of electronic assembly is a high-precision welding technology mainly used for the welding of small and precision components. The laser soft soldering system uses a semiconductor laser as the heat source to provide a highly concentrated laser energy beam to achieve high-quality welding with fast processing speed, a small heat-affected zone, and high precision. In the machining system, the performance of the semiconductor laser directly affects the welding effect with current and temperature being critical parameters to control. These parameters directly affect the focusing and energy distribution of the laser beam. Semiconductor lasers, also known as laser diodes, are electrooptical conversion devices. During processing, part of the electrical energy is converted into heat, causing the temperature to rise. This rise in temperature decreases the efficiency of the semiconductor material and the laser's output power.Excessive temperature leads to laser wavelength drift, affecting the interaction between the laser beam and the material.Conversely, too low a temperature can make the laser difficult to start and result in unstable output power. Therefore, to ensure the performance and reliability of semiconductor lasers, it is crucial to develop a temperature control system to maintain temperature stability.Methods To address these issues, we propose a temperature control system for semiconductor lasers based on a model predictive controller(MPC). First, a mathematical model is established for the thermoelectric cooler(TEC) and other components of the thermal control apparatus. Subsequently, a predictive control model for the laser's thermal control system is constructed using this mathematical model and software simulations. Finally, the feasibility of the design is validated through practical experimentation on an experimental platform specifically designed for laser soldering processes.The experimental verification involves actual laser soldering operations, confirming the

关 键 词:激光器 热控系统 模型预测控制 激光软钎焊 

分 类 号:TP273[自动化与计算机技术—检测技术与自动化装置]

 

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