金属芯PCB及其散热控温作用  

Metal-core PCB and Its Heat Dissipation and Temperature Control Functions

作　　者：徐伟明[1] 曾福林[1] 安维[1] XU Weiming;ZENG Fulin;AN Wei(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2024年第5期1-3,20,共4页Electronics Process Technology

摘　　要：随着电子设备尤其是高性能计算对散热性能要求愈来愈高,散热系统重要性日益凸显。讲述了电子系统散热管理的重要性,介绍了金属芯印制电路板(Metal Core Printed Circuit Board,MCPCB)的原理、结构、工艺、作用与类型,阐述了金属芯电路板的主要性能、导热性粘接介质材料的设计、两组数学模式,以及金属芯电路板在通讯设备、汽车电子、照明、电源、能源板领域的应用情况,为CCL及PCB从业者提供借鉴。With the increasing requirements of electronic devices,especially high-performance computing,for heat dissipation performance,the importance of heat dissipation systems is increasing.The importance of heat dissipation management of the electronic system is described,the principle,structure,process,functions and types of the metal-core PCB is introduced.The main performance of the metal-core PCB,the design of the thermally conductive bonding medium material,and two groups of mathematical modes is expounded,and the application of the metal-core PCB in the fields of communication equipment,automobile electronics,lighting,power supply,and energy boards is introduced,which can provide reference for CCL and PCB practitioners.

关 键 词：MCPCB 导热粘接片 导热率 

分 类 号：TN605[电子电信—电路与系统]