自动光学检测技术在引线键合中的应用  

Application of Automatic Optical Inspection Technology in Wire Bonding

作　　者：崔洪波[1] 孟祥毅 吴峰 方健 CUI Hongbo;MENG Xiangyi;WU Feng;FANG Jian(The 55th Research Institute of CETC,Nanjing 211100,China)

机构地区：[1]中国电子科技集团公司第五十五研究所,南京211100

出　　处：《电子工艺技术》2024年第5期24-27,共4页Electronics Process Technology

摘　　要：微电子产品内部结构复杂,引线数量多且分布无规律,给人工检验带来了巨大挑战。自动光学检测具有效率高且漏检率低的特点,可实现产品引线键合正确性的自动化检验。对引线键合的自动光学检测原理进行深入分析,结合实际生产,着重介绍键合点编号技术。实现了引线键合的自动化检验,确保引线键合的正确性,并且极大降低了误报率。In the field of microelectronics,many products have a complex internal structure,a large number of wires and irregular distribution,which brings great challenges to manual visual inspection.Automatic optical inspection can realize automatic inspection of the bonding correctness,because of its high efficiency and low misdetection rate.The principle of automatic optical detection of wire bonding is deeply analyzed,combined with the working conditions,the bonding point numbering technology is emphatically introduced.The automatic inspection of wire bonding is realized,which ensures the correctness of wire bonding,and the false alarm rate is reduced greatly.

关 键 词：自动光学检测 引线键合 正确性 误报率 

分 类 号：TN406[电子电信—微电子学与固体电子学]