离子研磨仪在PCB及IC载板检测中的应用  

Application of Ion Milling Instrument in Inspection of PCB and IC-substrate

作　　者：霍发燕 孟伟 计欣磊 HUO Fayan;MENG Wei;JI Xinlei(Shanghai Meadville Science&Technology Co.,Ltd.,Shanghai 201613,China)

机构地区：[1]上海美维科技有限公司,上海201613

出　　处：《电子工艺技术》2024年第5期55-58,共4页Electronics Process Technology

摘　　要：离子研磨(Ion Milling)是一种非接触式、高精度材料加工技术,通过带电核束轰击样品表面,使得样品表面的原子和分子发生位移和变形,从而实现对样品的精细加工。在PCB及IC载板检测中的常见应用方法有异物失效分析、界面分析,EBSD分析。离子研磨仪与FIB制备样品的SEM扫描效果一致,不但可以进行平面和截面磨抛,测试区域大,而且对EBSD样品制备有很大优势。Ion Milling is a non-contact,high-precision material processing technique that uses a charged nuclear beam to displace and deform atoms and molecules on the surface of a sample.Common applications in PCB and IC-substrate inspection include foreign body failure analysis,interface analysis,EBSD analysis.The SEM scanning effect of the Ion Milling machine is the same as that of the sample prepared by FIB,which not only can be used for plane and cross-section grinding with large test area,but also has the advantages for EBSD sample preparation.

关 键 词：离子研磨仪 PCB IC载板 失效分析 EBSD分析 FIB 

分 类 号：TN606[电子电信—电路与系统]