表面镀层与无铅锡膏焊接兼容性的研究  

Study on the welding compatibility of PCB final finishing and lead-free solder paste

作　　者：潘浩东 蒋少强 王剑[2] 聂富刚 王世堉[2] 李伟明[1] 何骁[1] PAN Haodong;JIANG Shaoqiang;WANG Jian;NIE Fugang;WANG Shiyu;LI Weiming;HE Xiao(The 5th Research Institute of MIIT,Guangzhou 511370,Guangdong,China;Zhongxing Telecom Equipment Corporation,Shenzhen 518000,Guangdong,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370 [2]中兴通讯股份有限公司,广东深圳518000

出　　处：《印制电路信息》2024年第9期52-56,共5页Printed Circuit Information

摘　　要：印制电路板组装(PCBA)中,焊点作为电气连接和机械支撑结构,对电子产品的可靠性起着至关重要的作用。以A、B 2种锡膏为研究对象,分别与有机可焊性保护层(OSP)、化学镍金(ENIG)表面处理的印制电路板(PCB)进行焊接,对形成的焊点进行焊接质量评估。结果表明锡膏A相对于锡膏B在焊接后空洞较少,在抵抗冲击方面锡膏A要更优,但剪切强度却是锡膏B更优;ENIG表面处理下焊点的抗剪切强度要优于OSP表面处理下的焊点,OSP镀层形成的金属间化合物(IMC)则更为均匀。Solder joints,as electrical connections and mechanical support structures,play a crucial role in the reliability of electronic products in the assembly of printed circuit boards(PCBs).This paper takes solder paste A and B as the research object,welding on PCB surfaces treated by organic solderability preservative(OSP)and electroless nickel/immersion gold(ENIG)respectively,to evaluate the welding quality of the formed solder joints.The results show that solder paste A has fewer holes after welding than solder paste B,and solder paste A has better impact resistance,but its shear strength is worse than solder paste B.The shear strength of solder joints under ENIG surface treatment is better than that under OSP surface treatment,and the inter metallic compound(IMC)formed by OSP coating is more uniform.

关 键 词：无铅锡膏 印制电路板镀层 焊点强度 兼容性 

分 类 号：TN405[电子电信—微电子学与固体电子学]