基于X射线衍射形貌术的碲锌镉晶体样品制备方法研究  

Study on the Preparation Method of Cadmium Zinc Telluride Crystal Samples Based on X-ray Diffraction Topography

作　　者：王琰璋 刘江高 李振兴 柏伟[1] 李乾 折伟林[1] WANG Yan-zhang;LIU Jiang-gao;LI Zhen-xing;BAI Wei;LI Qian;SHE Wei-lin(North China Research Institute of Electro-Optics,Beijing 100015,China)

机构地区：[1]华北光电技术研究所,北京100015

出　　处：《红外》2024年第9期23-28,共6页Infrared

摘　　要：基于传统X射线衍射形貌术(X-Ray diffraction Topography,XRT)的碲锌镉晶体样品制备方法是通过对测试晶片进行磨抛加工,获得满足测试条件的表面。随着单晶晶片尺寸的增大,晶片磨抛加工的难度变大、耗时变长,而且还容易导致晶片损坏。针对上述问题,通过对切割研磨后的晶片腐蚀方法进行研究,获得了一种新的XRT样品制备方法。该方法能够快速去除晶片的表面损伤,获得满足XRT测试要求的晶片表面,大幅减小制样难度并缩短制样时间。使用该方法制备的样品X射线衍射形貌图像衬度均匀、信噪比较好,各类型晶体缺陷均可被检测出来。此技术能够很好地应用于大尺寸碲锌镉晶片的后续筛选和加工。The sample preparation method of Cadmium Zinc Telluride(CdZnTe)crystals based on traditional X-ray diffraction topography(XRT)is to grind and polish the test wafer to obtain a surface that meets the test conditions.As the size of single crystal wafers increases,the difficulty and time consumption of wafer grinding and polishing processing become higher,and it is also easy to cause wafer damage.To solve the above issues,a new method for preparing XRT samples has been obtained by studying the corrosion method of wafers after cutting and grinding.This sampling method can quickly remove surface damage from the wafer,obtain the wafer surface meeting XRT test requirements,significantly reduce sampling difficulty and shorten sampling time.The XRT image of the sample prepared by this method has uniform contrast and good signal-to-noise ratio.All types of crystal defects can be detected.This technology can be well applied to the subsequent screening and processing of large-sized cadmium zinc telluride wafers.

关 键 词：碲锌镉晶体 X射线衍射形貌术 晶体缺陷 

分 类 号：TB31[一般工业技术—材料科学与工程] TN213[电子电信—物理电子学]