基于Chiplet的三维集成计算与存储架构  

Chiplet-Based Computing and Memory Three-Dimension Integration Architectures

作　　者：单光宝 凡翔 郑彦文 曹会华 SHAN Guangbao;FAN Xiang;ZHENG Yanwen;CAO Huihua(School of Microelectronics,Xidian University,Xi’an 710071,China)

机构地区：[1]西安电子科技大学微电子学院,西安710071

出　　处：《电子与封装》2024年第9期1-11,共11页Electronics & Packaging

基　　金：科技部重点研发计划(2022YFB4401301);国家自然科学基金创新群体(62021004);国家自然科学基金重点项目(62134005)。

摘　　要：5G通信、人工智能、物联网技术的蓬勃发展对计算与存储系统架构提出了更高需求。传统二维计算与存储架构无法满足当下计算密集型应用对延时、带宽和能效的需求。基于Chiplet的三维集成架构可以有效解决传统二维计算与存储系统性能优化面临的诸多瓶颈。回顾了基于Chiplet的计算与存储架构,介绍了单片多核、异构多核及基于Chiplet的三维集成架构,概述了基于Chiplet的主流存储架构与新兴的存算一体架构,并对计算架构与存储架构分别进行了比较与讨论。给出了基于Chiplet的三维集成计算与存储架构设计面临的挑战和未来发展方向。The vigorous development of 5G communication,artificial intelligence,and the Internet of Things technology has put forward higher requirements for computing and memory system architectures.Traditional two-dimensional computing and memory architectures cannot meet the requirements of delay,bandwidth and energy efficiency in current computing-intensive applications.The Chiplet-based three-dimensional integration architecture can effectively solve many bottlenecks faced by traditional two-dimensional computing and memory system performance optimization.The Chiplet-based computing and memory architectures are reviewed.The monolithic multi-core,heterogeneous multi-core and Chiplet-based three-dimensional integration architectures are introduced.The Chiplet-based mainstream memory architectures and the emerging processing-in-memory architectures are summarized,and the computing architectures and memory architectures are compared and discussed respectively.Challenges and future development directions of the Chiplet-based three-dimensional integrated computing and memory architecture design are given.

关 键 词：Chiplet 三维集成 计算架构 存储架构 存算一体架构 

分 类 号：TN402[电子电信—微电子学与固体电子学]