导电胶加速寿命模型评价方法研究  

Research on Evaluation Method of Conductive Adhesive Accelerated Life Model

作　　者：文科[1] 谭骁洪 邢宗锋[1] 罗俊[1] 余航 WEN Ke;TAN Xiaohong;XING Zongfeng;LUO Jun;YU Hang(China Electronics Technology Group Corporation No.24 Research Institute,Chongqing 400060,China)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《电子与封装》2024年第9期85-88,共4页Electronics & Packaging

摘　　要：简要介绍了导电胶的失效模式和机理,设计加速寿命试验对导电胶工艺可靠性开展研究,选取导电胶工艺中的关键参数进行正交试验,确定温度应力作为导电胶贴装失效的加速应力。采用定时截尾方法进行试验,利用Arrhenius模型对试验结果进行分析,建立导电胶加速寿命可靠性评价模型,最终完成了对导电胶加速寿命可靠性模型的评价,为导电胶工艺在半导体集成电路中的应用和可靠性改进提供依据。The failure mode and mechanism of conductive adhesive are briefly introduced,the reliability of conductive adhesive process is studied by designing accelerated life test,the key parameters of the conductive adhesive process are selected for orthogonal test,the temperature stress is determined as the accelerating stress of adhesive mounting failure.The timed truncation method is used for the test.The Arrhenius model is used to analyze the test results.The reliability evaluation model of conductive adhesive accelerated life is established.The evaluation of the accelerated life reliability model of the conductive adhesive is finally completed,which provides a basis for the application and reliability improvement of conductive adhesive process in semiconductor integrated circuits.

关 键 词：导电胶工艺 加速寿命 正交试验 可靠性 

分 类 号：TN306[电子电信—物理电子学]